Jun 11, 2010 
This presentation will review the analytical tools and techniques used to identify and verify root causes in electronic hardware failures. Not only will the presentation show equipment capability and techniques, but there also will be case studies showing real life examples of failed hardware. The combination of case studies and equipment capabilities and techniques will provide engineers and program managers and procurement with a better understanding of the quantitative methods available to them for understanding root causes and failure mechanisms that can affect hardware.
FA and materials qualification testing results in better and more robust designs as well as better manufactured hardware is only one tool set available to designers, reliability and process engineers in the quest for zero-free defects in their manufactured electronic hardware.
Mark T. McMeen joined STI Electronics Inc. as Vice President of Engineering Services in July 2000. Prior to STI, Mr. McMeen was the Vice President of Engineering and Technical Director of Component Intertechnologies, Inc. He currently oversees the daily operations of the Engineering Services division of STI. He has more than 20 years experience in the manufacturing and engineering of printed circuit boards, both flexible and rigid, as well as in the manufacture of electronics assemblies. Mr. McMeen holds a Bachelor of Science degree from the University of Montevallo in Corporate Finance and a minor in Cost Accounting.
Since 1982, STI Electronics, Inc. (STI) has been the premier full service organization for training, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly in the electronics industry. STI also produces a complete line of solder training kits and training support products. Additionally, the company distributes products for the electronics and industrial markets. For more information, visit http://www.stielectronicsinc.com
