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CyberOptics to Exhibit Latest Inspection Equipment at JISSO PROTEC 2010

May 26, 2010

SE50™, 3-D solder paste inspection system.

SE50™, 3-D solder paste inspection system.

MINNEAPOLIS - CyberOptics Corporation (Nasdaq: CYBE), a leading SMT inspection solutions provider, announces that it will highlight its QX500™, SE350™ and SE500™ in booth 3D-03 at the upcoming JISSO PROTEC exhibition, which is scheduled to take place June 2-4, 2010 at the Tokyo Big Sight in Japan.

The QX500™ will be highlighted on the show floor with back-to-back demos. The AOI system represents a quantum leap in inspection technology, system design and speed, and improved cycle times. The QX500™ combines a unique image acquisition solution to provide highest-speed inspection at 100 cm²/sec. The introduction of SIM modules in QX500™ offers “on-the-fly” AOI inspection combined together with CyberOptics’ patented image processing technique, SAM. This dual advantage undoubtedly sets it apart from the conventional inspection methods.

The QX500™ uses white strobed lighting that consists of dual fixed angle lighting providing a superb image for defect review. Users can further enhance component features by choosing a combination of lightings. QX500™ is designed to provide the ideal platform that can be integrated in assembly lines which manufacture memory modules, notebook PCs, mobile phones, automotive products, and other industrial electronic assemblies.

SE350™ is the latest addition to CyberOptics’ 3-D solder paste inspection system portfolio. The simple and robust SE350 design with CyberOptics calibration-free sensor technology offers the lowest cost of ownership in the industry with zero machine-to-machine variation across the production lines. Leveraging on the technology of SE500, this system is capable of inspecting pad sizes down to 01005 component size (150 x 150 μm).

CyberOptics also will display the industry recognized, award winning SE500™ 100 percent 3-D solder paste inspection system at the show. This system has the ability to inspect the most demanding assemblies with a >80 cm2/second inspection speed without compromise to measurement accuracy and repeatability.

Building on CyberOptics’ reputation as the leading provider of solder paste inspection systems with industry-leading volume accuracy, the SE500 can inspect pad sizes down to 01005 component size (150 x 150 µm) while keeping up with ever-increasing line speeds.

For more information, visit booth 3D-03 at the show or visit http://www.cyberoptics.com.

Founded in 1984, CyberOptics is a recognized leader in process yield and throughput improvement solutions for the global electronics assembly and semiconductor capital equipment markets. Headquartered in Minneapolis, MN, CyberOptics conducts operations in North America, Asia and Europe. For more information, visit the company’s Web site at http://www.cyberoptics.com

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