Papers should describe significant results from experiments, emphasize new techniques, and contain technical, economic or appropriate test data. Materials should be original, unpublished and non-commercial in nature.
Short course descriptions are also being solicited.
Papers are being solicited in the following categories:
Emerging Technologies: 0201/01005 Components and Assembly, Consumer Applications, Electronic Printing Technology, Embedded Technology / Actives and Assembly, Flexible Electronics, MEMS/RF, MEMS/MOEMS, Nanoelectronics, Reliability of Nanodevices, New Materials and Processes, Optoelectronics, Power or Thermal Management, Sensors and Manufacturing, Solar Technology, System in a Package, Thermal Interface Materials, and Wireless Applications including Bluetooth and Wi-Fi
Components: BGA, Battery Interactions, BTCs (Bottom Termination Components), CSP (including Wafer-Level Packages), Component Solderability, Component Reliability, Connectors, Embedded Passives, Failure Analysis, Fine Pitch Technology, Flip Chip / Direct Chip Attach, Lead/Termination Finish, Leadless Packaging, Multichip Packages (including 3-D Packaging, Package on Package), and Tin Whiskers.
Assembly: Adhesives, Alternate Alloys, BGA/CSP Assembly, Cleaning, Connector Technology, Copper Erosion, DFX/Design for Six Sigma, Dispensing, Equipment Selection, Facility Layout, Flux and Solder, Halogen and Halogen-Free, Head-in-Pillow Defect, Land Pattern Design, Lead-Free Soldering (including case studies), Lead-Free Reliability, Lean Manufacturing, Low Volume / Prototype Assembly, Medical Electronics, Placement, Printing, Reflow Soldering, Rework and Repair of QFNs, RFID Assembly, Selective Soldering, Set Up Reduction, Solder Paste, Solder Voids, Supplier Engineering, Underfill, Vapor Phase Reflow for High Reliability Assemblies, Wave Soldering, Yield Improvement.
PCB Technology: Black Pad and Surface Finish Defects, Embedded Passive and Active Components, Halogen Free, HDI, Microvias (including filled and unfilled), Moisture Sensitivity, Soldermask, Substrate Reliability, Substrate Solderability, Surface Finish.
Process Control: Acoustic Imaging, AOI, CIM, In-Circuit Test, Process Modeling, Software, Test Strategies, X-Ray.
Harsh Environment Applications: Components and Component Reliability, Lead-free Issues for Harsh Environments, Substrates, and Thermal Management.
Business: Capacity Modeling, Contract Manufacturing, Doing Business in Asia, Environmental Issues, Lean Manufacturing / Quality Initiatives, Operations Management, Remaining Competitive, RoHS Compliance, Supplier Management, Technology Roadmaps.
Late Submission Abstracts Due: March 26, 2010 | Acceptance: May 20, 2010 | Manuscripts Due: August 2, 2010
There are many benefits to participating:
- You will be making a contribution to our industry by sharing your work.
- You will help to advance the industry and your company as you will be recognized by industry colleagues.
- Discounted conference registration.
- $1,000 cash awards for the best of conference paper, best of proceedings paper, and best international paper.