NEPCON China 2010 Steps into Spring

Apr 14, 2010

Professional exhibition is generally the barometer of industry development. As one of the largest professional exhibitions of the Chinese electronics manufacturing and surface mount industry, NEPCON China undoubtedly reflects the reality of the electronics manufacturing industry climate in China. The continuous downturn of the global economy since 2008 frustrates many vendors in the industry in respect to the future of the market. In 2009, the economy in China grew successfully by more than 8 percent. In 2010, China will make further adjustments to industrial structure while keeping sustainable economic growth. Based on this, what is the future of the electronics manufacturing industry? Visitors will obtain personal experience at NEPCON China 2010, which will be held on April 20, 2010 in Shanghai.

The overall size of NEPCON China 2010 will be increased dramatically over last year. As the NEPCON brand penetrates new industries and regions, the 2010 exhibition will bring more high-quality, professional visitors and buyers together, and is expected to attract 17,000 visitors. The exhibitors from around the world will exceed 500. In addition to famous brands like Agilent, Assembléon, Siemens, Sony, Hitachi, Panasonic, Samsung, Fuji, Henkel, Yamaha, JUKI, DEK and Speedline, NEPCON China 2010 has attracted many companies that will participate in the event for the first time, including Toyorobot, Rockbond, Kedtch, Szsunsport, Ctoptest, Keyence, Nagoya Electric and Crest.

It is without doubt that new products and leading technologies from the exhibitors will be the absolute leading factor of this event. In 2010, a variety of exhibitors will showcase mainstream products and advanced technologies covering several areas of interest. More exhibitors will use NEPCON China 2010 as a platform to debut new products or technologies than anywhere else in Asia or even, perhaps, the world. As an industry driven by technology, even during the period of economic downturn, the innovation of product and technology in the electronics manufacturing industry never stops. One of main goals of NEPCON China is to keep visitors understanding these new products and technologies.

In the line of printing machinery, Speedline Technologies will showcase its MPM Momentum Dual Lane, which offers a cost-effective, reliable and versatile machine. All rails are movable under software control to accommodate a variety of board sizes and automate conversion from single to dual lane. Multiplexed control architecture allows for the use of a single electrical drive control system instead of 5 control units. Evest’s OED-560/580 series is designed for high brightness LED manufacture and other high-tech dispensing applications. There are 6-16 dispensing heads, with 8,000-22,000UPH, and they can support various substrates including lead frame, ceramic and PCB boards.

In the placement category, Siemens will display its SIPLACE SX, a global revolutionary gantry modularity placement machine. As a benefit of the gantry modularity concept, the SIPLACE SX allows productivity among production lines to be adjusted easily without any change to the current line layout of production lines and the feeder position setup, maximizing the flexibility of the production lines. Europlacer will feature its new SMT platform XPii. XPii uses Europlacer proven core features, such as turret head, intelligent feeders and powerful software without compromise. It can handle components as small as 01005 and as large as 50 x 50 mm. MYDATA’s MY100DX14 with a top speed of 34.000 cph features the fastest production set-ups and production changeovers in the industry. The MY100DX14 is the optimum all-round machine solution that provides both speed and outstanding ease of use. Its newest IPSys software the Line Mode Option makes combinations of multiple machines in MYDATA Synergy  configurations work as one. JUKI will display its JX-100 LED. The new machine can adapt for LED production that spreads rapidly. The board size is 50 x 50 mm to 800 x360 mm, which is suitable for LED long size boards. Featuring a smaller and lighter body, the JX-100 LED uses the same highly accurate state-of-the-art laser centering found on higher end models.

With the miniaturization of components, test equipment has drawn more attention. Folungwin will introduce FL-DV5 AOI, which is equipped with unique color image identification algorithms, a high pixel CCD camera, a high-definition imaging system offering high speed and high accuracy inspection with great repeatability and low false reject calls. It can be used for post-printing, post-mounting and post-soldering inspection. Agilent Technologies’ latest Medalist i3070 Series 5 ICT offers a brand new ASRU Revision N card for even faster throughput. Its flexible Agilent Utility Card allows easy plug-in tests like in-system flash programming.

Also, many exhibitors will showcase more eco-friendly materials. ZESTRON will bring the water-based MPC®-cleaner VIGON® N 501 that was specifically developed for spray-in-air processes. Due to its neutral pH-value, it demonstrates the highest level of compatibility on SMT sensitive materials of SMT-production. Being used at short contact times and with concentrations of 10-15%, it shows good cleaning results, even under low standoff components. Henkel’s Multicore® HF108 answers the industry’s call for a true halogen-free, lead-free solder paste. With performance that is comparable to that of other well-known Henkel lead-free solder pastes, Multicore® HF108 enables excellent high-speed print capability and provides a wide process window for exceptional manufacturing flexibility.

In addition to product demonstrations, NEPCON China 2010 will provide visitors with many technical seminars and a large number of industry communication activities. During the exhibition, several technical forums and seminars organized by industry associations will be held. The China branch of the Surface Mount Technology Association (SMTA) will continue to hold the SMTA East China conference during the exhibition, covering the most urgent topics in the industry, including electronics manufacturing, advanced packaging and lead-free reliability. The Electronics Packaging and Technology Branch of the Chinese Institute of Electronic will cooperate with SMTA, CEPE and Shenzhen Toptouch Consulting & Media Co. to hold 2010 China Electronics Manufacturing and Packaging Technology Forum. This event will be held at the same time as NEPCON China. The forum will invite experts, professors and industry leaders from industrial, universities and research areas to deeply analyze and discuss the trend and technical innovations of the Chinese electronics manufacturing industry. The topics include new PoP, 3G PoP and 3D SCP in 3G mobile phones, new component (MCM/FC/SIP) packaging and assembly process and reliability, new optoelectronic packaging and assembly, new lead-free and halogen-free materials under new environment-friendly directives.

The award-winning ceremony of evaluation of electronics manufacturing and SMT industry engineers in China in 2010 will be held on the second day of NEPCON China 2010 (April 21). Reed Exhibitions will cooperate with SMT China, Youth Daily, Top Touch, and SMT HOME to organize an evaluation committee of more excellent talents and more authoritative personnel under the support of iNEMI, including Dr. Dongkai Shangguan, VP, Flextronics Global; Dong Enhui, GM, Telecom Technology Instrument Research Institute of Tatang Inc.; Mr. Ge Weihu, GM, HuanTai Technologies; and Ms Xi Xiong, manager Hudson Recruitment Shanghai, one of Asia’s leading providers of recruitment and talent management. The experienced evaluation committee increases the grand event of talent introduction and evaluation to a new level. The organizer designs very attractive awards for this evaluation and the winner of “Best SMT Engineer” in 2010 will receive a Costa Cruises 6-day and 7-night Japan and Korea vacation, which is famous for enjoying a variety of noble experiences. For more information or online registration, please visit

NEPCON China in this year is the 20th event while this year is the 25th year for China to introduce SMT automated placement production equipment. The organizer of the exhibition -- Reed Exhibitions -- cooperates with SMT Special Committee of Shanghai Electronics Institute, SMT Special Committee of Sichuan Electronics Institute and SMT Special Committee of Guangdong Electronics Institute to hold the ceremony of The 25th Anniversary of SMT's Entry into China and the 20th Edition of NEPCON China during the exhibition. Additionally, a variety of events including SMTe membership fellowship, Engineers Saloon and SMT Home membership meeting will be held during the exhibition, which will provide an extensive communication platform for visitors.

During NEPCON China 2010, China Solid State Lighting Alliance (CSA) and Reed Exhibitions will hold Green Lighting Shanghai Expo and Forum 2010 for first time. The 3-day exhibition will fully show the entire industry chain covering upstream extension material production and chip manufacturing, midstream components and modules packaging, and downstream lighting and display integration application, providing a unique business platform for new lighting sources and new energy lighting manufacturing industry.

With the accumulation of the exhibitions in the past 19 years, NEPCON China has become one of the most authoritative communication platforms in the electronics manufacturing industry. The visitors in various areas and levels can obtain their own value during the exhibition. During NEPCON China, visitors can obtain the information on latest products and technologies, fully understand the pulse of the electronics manufacturing market, and get trading business opportunities and seize new partners. Additionally, in order to meet diversified needs from exhibitors, Reed Exhibitions is committed to the creation of NEPCON integrated marketing solutions including exhibition, roadshow, mobile marketing, Web site and magazines, helping the vendors build a complete and effective marketing platform. With a full upgrade of development strategy, the 20th NEPCON China will bring more confidence and energy to the industry.

For more information on NEPCON China 2010, please visit

About Reed Exhibitions– Asia’s Electronics Event Experts

Reed Exhibitions is the world’s leading events organizer, with over 440 events in 36 countries. In 2009, Reed brought together over six million active event participants from around the world generating billions of dollars in business. Today, Reed events are held throughout the Americas, Europe, the Middle East and Asia Pacific, and organized by 35 fully staffed offices.

Reed Exhibitions is committed to serving the electronics industry over the long term. We deliver 10 quality electronics events in seven Asian countries. These events bring together nearly 6000 exhibitors and over 200,000 buyers. By organizing leading events in the region, such as InterNEPCON, NEPCON China, NEPCON Korea and GlobalTRONICS, we demonstrate our commitment to the highest standards of quality and customer care and work with the very best domestic partners to deliver our events. Our exhibition specialists are always pleased to leverage their skills and share their best practices for the benefit of our customers. So, wherever you want to do business, you will experience the same quality events with high standards of service and professionalism.

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