BANNOCKBURN, Ill., USA, — IPC — Association Connecting Electronics Industries® has released the E revision of IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies. Recognized worldwide as the sole industry-consensus standard for soldering processes and materials, IPC J-STD-001E encompasses advanced technologies and provides new and updated criteria for all three classes of construction as well as expanded support for lead-free manufacturing.
The product of a four and a half year revision process involving more than 3500 meeting hours from dedicated volunteers in the United States, Asia and Europe as well as countless hours of industry-wide review through the consensus-building balloting process, IPC J-STD-001E contains new, expanded, updated and consolidated soldering criteria. Some of the significant changes are: new hole-fill criteria for Classes 1 and 2, new SMT termination criteria (flattened post/nail-head), expanded area array (noncollapsible balls and column grid array), expanded staking and adhesive criteria for bonding of through-hole and SMT components to PCBs, consolidated thermal management criteria and consolidated lead placement and soldering criteria for each terminal type.
In addition to the technical changes made to the standard, extensive enhancements were made to the organization of the document to improve ease of use and clarity. New and updated, full-color illustrations facilitate further understanding.
Teresa Rowe, a director of quality at AAI, and chairman of the task group responsible for the standard, believes IPC J-STD-001E marks a major step forward for product developers and manufacturers. "At the end of the day, achieving an acceptable soldered connection is a very important process journey. This standard provides a map to that journey which begins and ends with customer satisfaction," she said.
To help industry members understand the impact of the changes comprised in IPC J-STD-001E, Rowe and Daniel Foster, senior analyst with Defense Acquisition Inc., and vice chair of the IPC J-STD-001 Task Group, will lead a course, "The NEW J-STD-001 Revision E — Learn from the Leaders,"at IPC APEX EXPO on Friday, April 9. Rowe and Foster will provide insight into the revisions and explain the reasoning behind the final changes. A copy of IPC J-STD-001E will be provided to all course attendees. IPC APEX EXPO will be held April 6–8, 2010, at the Mandalay Bay Convention Center in Las Vegas.
The first copies of IPC J-STD-001E, Requirements for Soldered Electrical and Electronic Assemblies, will be available for purchase in the IPC Bookstore at IPC APEX EXPO, booth 2073. IPC member pricing will be extended to all IPC APEX EXPO attendees, regardless of membership status.
For information on the IPC-J-STD-001E course at IPC APEX EXPO or to register, visit http://www.IPCAPEXEXPO.org.
IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.7 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; Moscow, Russia; and Shanghai and Shenzhen, China.