SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from Juki Automation Systems


Juki’s Director of Technology, Gerry Padnos, to Present at APEX 2010

Mar 30, 2010

Gerry Padnos, Director of Technology.

Gerry Padnos, Director of Technology.

MORRISVILLE, NC - Juki Corporation is pleased to announce that Gerry Padnos, Director of Technology, will present a paper titled "PCB Assembly System Set-Up for Package-on-Package (PoP) Technology" at the upcoming IPC/APEX conference and exhibition, scheduled to take place April 6-8, 2010 at the Mandalay Bay Resort & Convention Center in Las Vegas. The presentation will be held during Session S19, titled "POP I: The Practical Solution for Mixed Function IC Integration," which will take place Wednesday, April 7, 2010 from 10:15-11:45 a.m.

Package-on-Package or PoP technology was developed to provide more functionality in a smaller footprint for the fast paced consumer electronics market. Electronics design and assembly has traditionally been a two-dimensional process, with each component being placed on the same horizontal plane in different X and Y locations. With PoP technology, components can be placed or stacked on successively higher layers. Using PoP devices allows designers more flexibility and decreases the development time and cost. From the assembly system point of view, PoP requires new techniques when compared to standard SMT assembly.

Since components are stacked on top of each other, traditional solder paste printing cannot be used. The typical SMT method to print solder paste can only be used to print paste on a single horizontal plane. For PoP, the components that are placed on top of existing components need to have flux or solder paste applied at the time of assembly. This paper will explore the challenges and solutions of PoP assembly for the SMT assembly system.

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