XPii is a refreshing new approach to modular pick-and-place. Incorporating technology from Europlacer's innovative award winning iineo platform, XPii benefits from low maintenance linear motors, high-resolution digital cameras and advanced on-head optical component sensing. With these advanced features you can benefit from all the capability of iineo in a compact space and the modularity enables you to build your line to meet growing demands.
XPii uses Europlacer proven core features, such as turret head, intelligent feeders and powerful software without compromise. It is equipped with a choice of turret heads and incorporates optical sensors that can detect, on the fly, the presence of components as small as 01005 and as large as 50 x 50 mm from picking to placement. XPii will accommodate components supplied on tape, strip tape, stick and matrix tray.
The system uses Europlacer's unique Integrated IntelligenceTM and fulfils all possible placement needs in one compact system. It is widely configurable, allowing two versions: XPii-I and XPii-II (one or two placement heads), 8 or 12 nozzles, tape trolleys or feeder trolleys, matrix tray sequencer, internal matrix tray. Unlike "traditional" chip-shooter style machines, XPii has on no restrictions or limitations on component range. The PCB in production remains stationary.
Winner of the Global Technology and NPI Awards, the iineo platform features many enhancements to the Europlacer machine range such as a higher feeder count, increased board size and increased maximum component height. The platform uses the company’s proven core features, including turret head, intelligent feeders, powerful software — while introducing technologies such as linear motors and digital cameras.
iineo is widely configurable, allowing for numerous different possibilities:
- Single or dual linear motor gantry including a rotary turret head with 8 or 12 pickups
- 1 or 2 board positioning mechanisms
- Oversized board options
- Huge feeder capacity to front and rear or front only.
The single-head iineo can handle maximum PCB sizes of 700 x 460 mm with options to handle up to 1610 x 600 mm. The double-head system can handle maximum PCB sizes of 500 x 460 mm with options to handle up to 700 x 600 mm. Both the single and dual-head iineo systems can handle minimum PCB sizes of 60 x 60 mm, board thickness of 0.5 to 10 mm, maximum weight of 3 kg and under board clearance of 25 mm. Additionally, both feature board edge clearance of 3 mm above/5 mm below, and left to right, fixed front rail transport criteria with a height of 950 mm (adjustable from 890 to 975 mm). Board location on both is full edge clamping with fiducial correction, and both systems feature a SMEMA interface.
The single-head iineo features one nozzle tool bank with 40 "smart" positions, and the dual-head configuration provides two nozzle tool banks, each with 40 "smart" positions. Both systems feature standard placement accuracy of 35 µm (QFPs) to 60 µm (chips), full range of intelligent feeders for 8-88 mm tapes, for components in plastic sticks and matrix trays, and a feeder capacity of 264 x 8 mm. Also, the single head iineo can accommodate an internal matrix tray capable of holding 10 full size JEDEC trays without loss of any feeder capacity
The single iineo has a rotary turret pick-up head on X/Y linear motor gantries with eight pick-ups each (12 pick-ups on Tornado head), while the dual-head iineo features two independent rotary turret pick-up heads.
Depending on the configuration, the following is possible:
- Maximum placement rate can be between 14,000 and 28,000 cph
- The largest PCB can reach 1,610 x 600 mm
- Component range is from 01005 to 70 x 70 mm
- The tallest component can be 34 mm height.
Possible options include glue dispense with Archimedean screw, electrical test, fixed camera, conveyor auto-width adjustment, special nozzle magazine, solder ball feeder and more.
For more information, please visit Europlacer's booth #1E03 at NEPCON China 2010.
Europlacer has been developing machines for electronics assembly since the 1970s and invented the intelligent feeder concept in the 1980s. After acquisition by Blakell Europlacer in 1991, the company moved away from split-axis to the inherently more capable X-Y architecture that underpins the company’s machines today. Europlacer’s policy has been to ensure wherever possible that technology purchased many years ago, especially feeders, remain compatible with the latest equipment. Europlacer designs and manufactures a comprehensive range of highly flexible SMT placement systems for the global electronics industry. For more information, visit Europlacer’s Web site at http://www.europlacer.com.