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SMTA International Conference on Soldering and Reliability Program Announced

Mar 03, 2010

Minneapolis, MN - The SMTA is pleased to announce the program for the 2010 International Conference on Soldering and Reliability being held May 17-20 in Toronto, Ontario, Canada. Following on the very successful 2005 and 2006 International Conferences on Lead-free Soldering, and the SMTA International Conference on Soldering and Reliability held in Toronto since 2007, this conference will bring together the community of soldering and reliability experts. The event will be co-located with the SMTA Lead-Free Academy and the SMTA Toronto Expo.

Technical conference speakers will represent Sonoscan, Nihon Superior, University of Seoul, Ryerson University, IBL-Lottechnik GmbH, and many other companies and schools. Jacklin Adams, IBM Corporation, will deliver the featured Keynote Presentation “Roadmap of the Environmental Technologies in Electronics” on Wednesday, May 19. All coffee breaks, lunches, and the evening reception on May 19th will be held in the exhibit hall to offer a networking opportunity for all exhibitors and conference attendees.

The SMTA Lead-Free Academy, May 17-18, will feature the following half-day tutorials:

  • True Design for Reliability - Understanding What is and What is not DfR

  • Taking Stress Out of Lead Free Assembly by Weeding out PCB Fabrication Defects Before Assembly

  • The Reality of Pb-Free Reliability

  • Reliability Issues of Lead-Free Solder Joints for Portable Devices

The conference is sponsored by the SMTA Toronto Chapter.

For more information or to register visit:

http://www.smta.org/education/symposia/symposia.cfm#toronto

Contact Melissa Serres at 952-920-7682 or melissa@smta.org with questions.

The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.

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