Semiconductor packages continue to challenge test engineers in terms of complexity, pitch, reliability and cost. The wafer-scale market has created a large demand for sub 0.5 mm high-volume testing technologies. Additionally, multiple functions are now being packed into one package and, in some cases, onto a single die. This creates the need for a variety of electrical capabilities such as low inductance, Kelvin contact, and high RF all in one contact set ? and at a lower cost for customers.
After outlining some of the current and future challenges associated with packaging trends, DeRosa will present a nontraditional spring probe technology that targets high-volume production applications.
This technology is a form of barrel-less architecture that is termed “flat” technology. Flat spring probes are made using nontraditional manufacturing processes rather than being turned on a lathe (as is the case with typical contact technology), stamped, etched or cut with a wire-EDM, as some alternative flat technologies are created.
This presentation will compare and contrast the traditional spring probe architecture (barrel and plunger) with flat technology probes.
This technology is proving itself more than capable of meeting these challenges. Real high-volume production data will be presented comparing flat probe vs. traditional spring probe performance for critical parameters such as test yield, probe life and cleaning frequency. Multiple probe technologies from multiple suppliers will be compared in multiple applications.
Multitest Elektronische Systeme GmbH, Rosenheim is one of the world’s leading manufacturers of test equipment for semiconductor. Under the brands Multitest, ECT Interface Products and Harbor Electronics Multitest market test handlers, contactors and ATE printed circuits boards. It has offices and branches in North America, Singapore, Malaysia, the Philippines, Taiwan, China and Thailand. Multitest has an annual turnover of greater than 100 million EURO and currently employs more than 750 people.