The Anritsu 3D Solder Paste Inspection System features numerous advanced technology features including ultra-high resolution: horizontal (10 µm/20 µm interchangeable) and vertical (1 µm, best in class), high-speed inspection (33 sq cm/sec at 20 µm resolution; 13.8 sq cm/sec at 10 µm resolution), and easy programming and maintenance in that program generation is accomplished in approximately five minutes and consistent results are provided, regardless of the operator.
Additionally, the system offers many benefits to users such as an automatic calibration function for easy maintenance, SPC software that is included as standard for detailed analysis and traceability, and reliable and accurate zero plane reference points.
Product literature also will be distributed for all Seika Machinery’s products. For more information about the Anritsu 3D Solder Paste Inspection System or Seika’s full product line, visit Seika at the SMTA Upper Midwest Expo & Tech Forum or visit http://www.seikausa.com.
About Seika Machinery, Inc.
Seika Machinery, Inc. (SMI) is a subsidiary of Seika Corporation, Japan and member of the Mitsubishi Global Group. SMI provides electronics manufacturers with advanced machinery, superior materials and engineering services.