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FINEPLACER® matrix – "The new generation" World premiere at Productronica in Munich

Dec 07, 2009

With the FINEPLACER® matrix, Finetech is not only extending its product range, but also pointing the way forward for the product family. The modular thinking behind the FINEPLACER ®s has been further perfected. Depending on the customer's requirements, the platform can be configured either as a high-end rework system or as a high-precision assembly and bonding system. In each case there are two accuracy options available, of 10 µm and 3 µm.

Unique machine concept

The FINEPLACER® matrix machine concept allows the configuration to be modified flexibly at any time. In this way, a few manual movements can convert a rework system into a bonder and vice versa. The flexible architecture and the systematic plug and work concept permit easy extension, conversion and retrofitting of the system with modules, thus opening up a wide spectrum of applications for the customer.

Whilst the rework configuration allows the entire repair sequence of desoldering, removal of residual solder, reballing, application of solder paste and resoldering in place to be reproduced, the micro-assembly configuration offers an enormous bandwidth of connection technologies. These include: bonding, adhesive bonding, thermal compression bonding, thermal/ultrasonic or micro-mechanical/optical assembly processes.

The machine is designed so that very small functional units can be exchanged on site during servicing. In this way the FINEPLACER® matrix combines quick conversion times with great ease of servicing and maintenance.

Setting new standards in its class

The striking combination of high placement accuracy, together with an especially large working area, permits the handling of components of the order 0.125 mm x 0.125 mm up to 100 mm x 100 mm for printed circuit boards, 450 mm x 350 mm for substrates and up to 12 inches for wafers. In addition to the standard applications, the FINEPLACER® matrix proves its capability especially when handling mixed functional units (MEMS/MOEMS) or multi-chip modules.

The system is always the machine of choice when very high precision and application flexibility are required and especially when standards of process reliability and reproducibility of results are demanded, specifications such as those found in medical technology, aerospace and the automobile industry.

Ergonomic design and automated processes

The new concept of the FINEPLACER® matrix aims to make using the machine as simple, reliable and efficient as possible. The ergonomic design allows non-fatiguing and intuitive working, even over extended periods. The aim of the development was not just to build a machine but to create a workplace appropriate to the user.

In addition, automated processes are provided to support the operator and potential sources of errors are minimised to ensure highly reproducible results.

An investment with a future

Future-proofing for the customer was an important consideration when developing the FINEPLACER® matrix. The current and planned requirements of the major OEMs were taken into account when developing the new platform. This provides planning security for the coming years and ensures a reliable return on investment.

The open architecture guarantees system compatibility with future developments in respect of new SMD package formats and connection technologies.

The FINEPLACER® matrix combines a user-oriented approach with the latest technical solutions and is thus the new reference standard for professional circuit board repair and micro-assembly.

Further details of the machine concept and technical specifications can be found from November onwards at

About Finetech

FINETECH is a leading manufacturer of equipment for manual and fully automatic circuit board repair and high-precision insertion of electronic/optical components, plus assembly and fitting of complex opto-electronic systems.

The modular FINEPLACER® systems are its core business; these offer maximum process flexibility in many different connection technologies. They include a wide variety of soldering and adhesive technologies, as well as ultrasonic and thermal compression bonding. FINEPLACER® systems are used especially in R&D, prototype building and small series production.

Finetech's customers include companies in the aerospace, automobile, medical/bio/solar technology, optoelectronics, semiconductor, consumer electronics and defence sectors, together with education and research establishments. Finetech responds flexibly to specific requirements and offers tailor-made solutions to highly-demanding customer applications. Finetech is represented by direct subsidiaries in its core markets and offers on-site application support and advice. It is also represented world-wide by a network of agencies.

The headquarters of FINETECH is Berlin, with subsidiaries in Phoenix (AZ), Shanghai and Penang / Malaysia.

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Finetech to Exhibit Sub-micron Die Bonder at SPIE Photonics West

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The Best in Rework Technology – Finetech to Exhibit FINEPLACER® Core Rework System at SMTA International

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MARTIN to Demonstrate Mini-Oven Reball/PreBump Unit at the Mississauga EPTECH Electronics Show

Sep 10, 2012 -

MARTIN to Participate in Package on Package (PoP) Design and Assembly Center SMTA International 2012

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