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Europlacer to Debut XPii Pick-and-Place Unit at Productronica 2009

Dec 07, 2009

Europlacer, a designer and manufacturer of comprehensive SMT placement systems for the global electronics industry, announces that it will debut its XPii modular pick-and-place system in Hall A2, Stand 439 of the upcoming Productronica exhibition, scheduled to take place November 10-13, 2009 at the New Munich Trade Fair Center in Munich, Germany.

XPii is a refreshing new approach to modular pick-and-place, incorporating technology from Europlacer’s innovative award winning iineo platform. XPii benefits from low-maintenance linear motors, high-resolution digital cameras and advanced on-head optical component sensing. With these advanced features, users benefit from all the capabilities of the iineo in a compact space. As an additional benefit, the modularity enables users to build lines to meet growing demands.

XPii uses Europlacer’s proven core features, such as turret head, intelligent feeders and powerful software without compromise. It is equipped with a choice of turret heads and incorporates optical sensors that can detect, on the fly, the presence of components as small as 01005 and as large as 50 x 50 mm from picking to placement. XPii will accommodate components supplied on tape, strip tape, stick and matrix trays.

The system uses Europlacer’s unique Integrated Intelligence™, and fulfills all possible placement needs in one compact system. It is widely configurable, allowing two versions: XPii-I and XPii-II (one or two placement heads), 8 or 12 nozzles, tape trolleys or feeder trolleys, matrix tray sequencer, and an internal matrix tray. Unlike traditional chip-shooter style machines, XPii has no restrictions or limitations on component range. The PCB in production remains stationary.

XPii is designed to meet specific production requirements. It can be used in front of any other Europlacer machine to greatly boost the placement rate of the line, or as a standalone unit, offering the perfect solution for manufacturing medium and/or large batches in high product mix environments, using minimal floor space. Thanks to the Europlacer concept of Integrated Intelligence™, featuring truly intelligent feeders and turret heads, XPii allows simple machine setups and rapid changeovers for maximum productivity.

XPii is fully compatible with other Europlacer systems with common heads, cameras, intelligent feeders, smart nozzles, placement data, and a very user friendly graphical interface.

Europlacer’s unique “smart” nozzle technology allows any nozzle to be placed anywhere within the magazines. Smart nozzles eliminate operator errors to ultimately increase machine uptime.

Machines include the innovative Adaptive Positioning System, or 3DPS, which is used to optimize picking and placement of components. During the picking sequence, the system compensates in X, Y and altitude, eliminating the need for manual picking adjustments. The 3DPS system compensates for board bow and twist on placement. Placement height is adjusted to reflect a similar board height to adjacent components. The placement force is optimum, even on a warped PCB.

Europlacer’s distribution partner in Germany, SmartTec GmbH, also will have a stand at the four-day event.

About Europlacer

Europlacer has been developing machines for electronics assembly since the 1970s and invented the intelligent feeder concept in the 1980s. After acquisition by Blakell Europlacer in 1991, the company moved away from split-axis to the inherently more capable X-Y architecture that underpins the company’s machines today. Europlacer’s policy has been to ensure wherever possible that technology purchased many years ago, especially feeders, remain compatible with the latest equipment. Europlacer designs and manufactures a comprehensive range of highly flexible SMT placement systems for the global electronics industry. For more information, visit Europlacer’s Web site at http://www.europlacer.com.

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