This BGA lens allows ball joints to be observed non-destructively. Additionally, a 3-D optical rotary ring enables 3-D observation. This lens incorporates special hardware, such as a prism tip with lighting and a cushion mechanism to ensure comfortable observation.
Furthermore, observation of the BGA exterior in detail helps specify various problems, such as overheating, oxidation, air foam formation, and their causes. The MX-BGAZ II allows inspection of the BGA ball’s upper and lower joints by changing the observation angle through the optical rotary ring. This information is useful in reviewing the temperature profiles.
Exterior observation allows for defect analysis of BGA mounting substrates and the creation of environments for preventing defects. The lens concentrates HIROX’s unique knowledge and technologies for observing BGAs from various angles in an easy manner.
The HIROX System was optimized for the characteristics of the imaging sensor — a flat, 2-D array with a known readout rate, response curve, pixel size, etc. The patented HIROX design can inspect objects dynamically in 360 degrees. Additionally, this superior BGA inspection system is capable of up to 180X magnification. The system features a spring-loaded lens tip to protect samples, and features a highly configurable and flexible lineup of lenses and peripheral devices.
For more information about the HIROX MX-BGAZ II, visit http://www.seikausa.com.
About Seika Machinery, Inc.
Seika Machinery, Inc. (SMI) is a subsidiary of Seika Corporation, Japan and member of the Mitsubishi Global Group. SMI provides electronics manufacturers with advanced machinery, superior materials and engineering services.