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Nihon Superior's NS-F850 Wins a 2009 NPI Award

Apr 08, 2009

OSAKA, JAPAN � March 2009 � Nihon Superior announces that it has been awarded a NPI Award in the category of Flux for its NS-F850. The award was presented to the company during a Monday, March 30, 2009 ceremony that took place in the Mandalay Bay Resort & Convention Center in Las Vegas before the start of APEX 2009.

NS-F850 ensures excellent wetting of all PCB and component substrates to deliver maximum through-hole fill and facilitates the solder drainage that ensures minimum bridges and icicles. It is the ideal flux for lead-free wave soldering. Additionally, the rosin-based flux ensures that the full reliability potential of SN100C lead-free solder is realized.

This eFlux for lead-free wave soldering provides excellent wetting and through-hole fill, and prevents solder balls from adhering to the solder mask. Furthermore, its matte finish facilitates inspection after soldering.

Premiering in 2008, the NPI Awards program is an annual celebration of product excellence in electronics surface mount assembly. Premier products based on the finest examples of creative advancement in technology are chosen by a distinguished panel of industry experts.

About Nihon Superior Co. Ltd.

Nihon Superior was founded in 1966 when it began marketing unique flux products imported from the US. The company made its mark on society by gathering the most advanced soldering and brazing technologies and products from around the world, and supplying them to companies in the metal-joining industry. A turning point for the company came when it started developing its own soldering materials and with the success of its unique SN100C lead-free solder alloy Nihon Superior has become a major player in the global market. To support the growing demand for its products Nihon Superior has established manufacturing and sales centers in Japan, China and other Asian countries and formed business partnerships with companies in other markets.

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