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News from CyberOptics Corporation

CyberOptics to Exhibit SE 300 Ultra� 3-D Solder Paste Inspection at APEX 2009

Mar 23, 2009

MINNEAPOLIS - March 2009 - CyberOptics Corporation (Nasdaq: CYBE) announced that it will showcase SE 300 Ultra, its industry-leading 100 percent 3-D solder paste inspection system, in booth 2071 at the upcoming APEX 2009 exhibition and conference, scheduled to take place March 31-April 2, 2009 in Las Vegas.

The SE 300 Ultra in-line, 100 percent inspection system provides accurate, repeatable results at speeds that keep up with increasing line cycle times. The SE 300 Ultra incorporates the field-proven technology and reliable features of the SE 300 along with new features.

New features include feature-level mode for defect review and pass/fail classification, Process Tracker� SPC charts with alarm capability in the Operator User Interface, an optional system sensor with an extended height range that can measure paste height up to 24 mils (610 �m), and a mechanical board stop solution.

Other recent additions include 1- and 2-D multiple bar codes read using the system sensor, an offline defect review workstation to allow users to easily review defects offline to maximize production throughput technology-leading 01005 pad inspection capabilities, enhanced warp compensation for flexible circuits, easy-to-use Operator Interface and Defect Review, and conveyor auto-width adjustment capability.

Offering ultra-fast inspection speeds, the system features a conveyor that accommodates panel sizes from 101 x 35 mm (4 x 1.4") to 508 x 508 mm (20 x 20"), flexible conveyor rail options � rear or front-fixed rail, program call-up using a bar code reader, and the ability to read skip marks and exclude data from inspection results.

Additionally, the SE 300 Ultra provides the ability to handle odd-shaped pads, superior paste height accuracy (each measurement calculated using 200k reference points) and an XML file format output for easy integration to shop floor control systems. The Ultra also features paste height, area and volume measurements with Gage R&R <10 percent.

About CyberOptics Corporation

Founded in 1984, CyberOptics is a recognized leader in process yield and throughput improvement solutions for the global electronics assembly and semiconductor capital equipment markets. Headquartered in Minneapolis, MN, CyberOptics conducts operations in North America, Asia and Europe. For more information, visit the company's Web site at

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CyberOptics to Exhibit SE 300 Ultra� 3-D Solder Paste Inspection at APEX 2009 news release has been viewed 973 times

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