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SMTAI Call for Papers

Mar 12, 2009

The SMTA International Technical Committee invites you to submit an abstract for the 2009 conference. Short course descriptions are also being solicited.

Papers should describe significant results from experiments, emphasize new techniques, and contain technical, economic or appropriate test data. Materials should be original, unpublished and non-commercial in nature.

Abstracts Due: April 24, 2009. | Acceptance: May 22, 2009 | Manuscripts Due: July 31, 2009

Papers are being solicited in the following categories:

Emerging Technologies: 0201/01005 Components and Assembly, Consumer Applications, Electronic Printing Technology, Embedded Technology / Actives and Assembly "Getters", MEMS/RF, MEMS/MOEMS, Nanoelectronics, Reliability of Nanodevices, New Materials and Processes, Optoelectronics, Power or Thermal Management, Sensors and Manufacturing, Solar Technology, System in a Package, Thermal Interface Materials, and Wireless Applications including Bluetooth and Wi-Fi

Components: BGA, Battery Interactions, CSP (including Wafer-Level Packages), Component Solderability, Component Reliability, Connectors, Embedded Passives, Failure Analysis, Fine Pitch Technology, Flip Chip / Direct Chip Attach, Lead/Termination Finish, Leadless Packaging, Multichip Packages (including 3-D Packaging, Package on Package), and Tin Whiskers.

Assembly: Adhesives, Alternate Alloys, BGA/CSP Assembly, Cleaning, Connector Technology, Copper Erosion, DFX/Design for Six Sigma, Dispensing, Equipment Selection, Facility Layout, Flux and Solder, Land Pattern Design, Lead-Free Soldering (including case studies), Lead-free Case Studies, Lead-Free Reliability, Lean Manufacturing, Low Volume / Prototype Assembly, Medical Electronics, Placement, Printing, Reflow Soldering, Rework and Repair of QFNs, RFID Assembly, Selective Soldering, Set Up Reduction, Solder Paste, Supplier Engineering, Vapor Phase Reflow for High Reliability Assemblies, Wave Soldering, Yield Improvement.

PCB Technology: Black Pad and Surface Finish Defects, Embedded Passive and Active Components, Halogen Free, HDI, Microvias (including filled and unfilled), Moisture Sensitivity, Soldermask, Substrate Reliability, Substrate Solderability, Surface Finish.

Process Control: Acoustic Imaging, AOI, CIM, In-Circuit Test, Process Modeling, Software, Test Strategies, X-Ray.

Harsh Environment Applications: Components and Component Reliability, Lead-free Issues for Harsh Environments, Substrates, and Thermal Management.

Business: Capacity Modeling, Contract Manufacturing, Doing Business in Asia, Environmental Issues, Lean Manufacturing / Quality Initiatives, Operations Management, Remaining Competitive, RoHS Compliance, Supplier Management, Technology Roadmaps.

IMPORTANT: PLEASE BE SURE TO OBTAIN APPROVAL TO BOTH WRITE AND PRESENT YOUR PAPER PRIOR TO SUBMITTING AN ABSTRACT. ONCE A PAPER IS ACCEPTED IT IS OUR EXPECTATION THAT YOU HAVE THE APPROVALS REQUIRED.

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