Mar 10, 2009 
SN100C P600 is a halogen-free high-reliability no-clean lead-free solder paste that does not contain F, Cl, Br and I. Designed as a high-reliability solder paste for high-density assembly with stable printability, the paste provides excellent reflow with good wetting and minimum incidence of mid-chip balling, low residue and significant cost advantages. Additionally, it typically can be reflowed with a profile similar to that which is commonly used with SAC305 and SAC405 with 240�C peak.
SN100C P520 is a high-reliability no-clean lead-free solder paste optimized to deliver good reflow with chip components down to 01005 (0402 metric). SN100C P520 improves the joint quality of densely populated boards with filletless, small solder volume chip components and fine-pitch mounting in which a reduction in joint strength is a concern due to the very small joint size. Additional benefits include low residue, excellent reflow characteristics on small pads, good hot slump performance, stable printability on small pads, excelling wetting behavior (even on brass and nickel). As an additional benefit to users, SN100C P520 generally can be reflowed with a profile similar to that commonly used with SAC305 and SAX405 with 240� peak. The paste is a compliant alloy that provides impact strength and substantial cost advantages.
SN100C P500 is a high-reliability no-clean lead-free solder paste with a general purpose. Because of its high fluidity close to its melting point and fast wetting, SN100C P500 can be used as a -in replacement for SAC solder paste in reflow profiles that peak around 240�C. However, it brings to reflow soldering the advantages that have made SN100C such a popular choice in wave soldering, i.e. smooth shiny fillets with no shrinkage defects, high ductility and stable intermetallic with consequent superior performance under vibration, and impact loading. The SN100C P500 no-clean halide-free medium delivers excellent printability, long stencil life, good tack, excellent reflow and wetting on all substrates with no solder balls and minimal clear residue.
SN100C (040) is a halogen-free high-reliability no-clean flux-cored lead-free solder wire that does not contain F, Cl, Br and I. This wire provides good separation of the solder from the tip with reduced incidence of icicles. Additionally, it results in reduced cracking of flux residue, fewer shrinkage defects, reduced copper erosion, cost advantages and a stable intermetallic layer.
SN100C (030) is a high-reliability no-clean flux-cored lead-free solder wire. The wire provides good separation of the solder from the tip with reduced incidence of icicles. It also provides numerous benefits including less tip and pad carbonizing, less flux splatter, less flux residue cracking, fast soldering and melting, good spread, and substantial cost advantages. Additionally, the wire provides fewer shrinkage defects, reduced copper erosion and a stable intermetalic layer.
As an additional service, Nihon Superior now has preform capability. It can provide very fine wire/cored wire down to 0.1 mm. Also, the company can provide SN100C as a foil and spheres for BGA.
NS-F850 is a rosin-based flux for lead-free wave soldering that ensures excellent wetting of all PCB and component substrates to deliver maximum through-hole fill and facilitate the solder drainage that ensures minimum bridges and icicles. It is the ideal flux for lead-free wave soldering. Additionally, the flux prevents solder balls adhering to solder mask, ensures that the full reliability potential of SN100C lead-free solder is realized.
For more information about any of the above SN100C products, please visit Nihon Superior's Booth 2564 at APEX 2009.
