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SMTA International Conference on Soldering and Reliability Call For Papers

Dec 15, 2008

Minneapolis, MN � The SMTA Technical Committee invites industry professionals to submit abstracts for the International Conference on Soldering and Reliability to be held May 20-22, 2009 in Toronto, Ontario, Canada. Following on the very successful events of the past two years, this conference will once again bring together the community of soldering and reliability experts.

Topics to be covered include:

  • SnPb with Lead-Free Components

  • Reliability

  • Harsh Environment

  • Tin Whiskers

  • New Alloys

  • Electromigration

  • Thermal dissipation

  • Manufacturing Process

  • Package on Package

  • Advanced Packaging

  • Halogen-Free Laminates

  • High Density Interconnects

  • Thermal Interface Materials

  • Underfill

200-300 word abstracts should be submitted to Melissa Serres Marx at melissa@smta.org or on-line at http://www.smta.org/education/education.cfm#toronto by January 16, 2009. Include a title, author name and contact information with your abstract. Technical papers are required for this event and will be due on April 7, 2009.

The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.

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