SMT, PCB Electronics Industry News

IDI Introduces Synergetix� Wafer-Level CSP Interposers

Nov 25, 2008

KANSAS CITY, KS � Interconnect Devices Inc., the world's leading manufacturer of spring contact probes, test sockets, and custom interconnect solutions announces the official release of Synergetix interposers for Wafer-Level Chip Scale Package (WLCSP) Testing.

The Synergetix test socket interposers are revolutionizing the testing of WLCSPs in vertical probing applications. With this technology rapidly emerging, IDI delivers a highly reliable, easily maintained, and eminently capable solution.

IDI interposers have a remarkably low cost of ownership beginning with their initial cost. The interposer consists of a plastic assembly containing IDI's proven semiconductor probe technology. Combined with an easy to design and fabricate load board, interposers require minimal attention throughout their extended life cycles.

WLCSP interposers are now available for use and feature several other significant benefits including:

- Lower initial investment

- Easy set-up and maintenance

- Extremely linear compression against the wafer leading to a longer mechanical life

- Particularly well suited for high current applications

- Average cleaning cycle every 50,000 touchdowns

- Contact replacement is rarely necessary before 500,000 tests

WLCSP Interposers have transformed the testing of WLCSP vertical probing applications to a new precedence compared to traditional technologies,� stated Mike Kirkman, President and CEO.

IDI is a leader in the design and manufacture of custom interconnects including high performance test sockets for the semiconductor industry and product connectors for the medical, military, aerospace, and telecommunications industries. For more information contact IDI at (913) 342-5544 , visit our website at (for probes and connectors) or (for test sockets).

Nov 25, 2008 -

IDI Introduces Synergetix� Dyno� Contact for QFN Testing

Apr 19, 2018 -

ULT LLC cooperates with GulfTech

Apr 18, 2018 -

MicroCare Presents its Latest Advancements in Cleaning at SMT Hybrid Packaging

Apr 18, 2018 -

SMTA Europe's Harsh Environments Conference Session 6 to Focus on Automotive Electronics

Apr 18, 2018 -

IPC Hand Soldering Competition Winner Crowned at Global Industrie/Midest 2018 in Paris

Apr 18, 2018 -

Koh Young Presenting on 3D Technologies at SMTA Rocky Mountain Chapter Technical Session

Apr 17, 2018 -

International Conference for Electronics Enabling Technologies (ICEET) Program Finalized

Apr 17, 2018 -

Seika Announces Plans for Optimized Drying Units to be Incorporated into all McDry Cabinets

Apr 17, 2018 -

Libra Industries Sponsors SMTA Ohio Valley Membership Appreciation Golf Outing

Apr 17, 2018 -

Preview for AdoptSMT for SMT 2018, Stand A4-458 We keep your production running -

Apr 17, 2018 -

cost saving SMT laser cut stencil

See electronics manufacturing industry news »

IDI Introduces Synergetix� Wafer-Level CSP Interposers news release has been viewed 1073 times

SMT Machines china

SMT in-printer dispensing