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IPC/SMTA High-Performance Electronics Assembly Cleaning Symposium Announces Panel Discussion on Cleaning Process Integration

Oct 20, 2008

ROSEMONT, IL � Industry-leading associations IPC and SMTA jointly announce that Steve Stach, President of Austin American Technology, will moderate a collaborative panel discussion on process integration. The panelists will comprise OEM and EMS process engineers who have experience and expertise in implementing cleaning processes. The panelists include Dave Adams of Rockwell Collins, Jerry Purnell of Philips Medical, Jeff Kennedy of Celestica, Jim Raby of STI Electronics, Dale Lee of Plexus, and Linda Woody of Lockheed Martin. The symposium, jointly sponsored by IPC and SMTA, will be held at Crowne Plaza Chicago O'Hare in Rosemont, IL on October 28-29, 2008.

The electronics industry is driven by demands for smaller, better, faster, cheaper, and more ecologically sound product designs. Process engineers are experiencing rapid change as the industry adopts lead-free designs. Additionally, the complexity of assemblies increases with the need to pack more circuitry into smaller spaces. From a reliability standpoint, cleaning is becoming more important.

This session will cover process integration of cleaning materials, and cleaning machines and support required to develop a wide processing window. The panelists will address how users integrate materials to address clean vs. no-clean, lead-free soils, cleaning under tight standoff components, and overcoming compatibility constraints. Attendees will gain an understanding of today's cleaning challenges and how users address those challenges within the manufacturing environment.

For more information about the conference, visit http://www.ipc.org/CleaningConferenceBrochure. Visit http://www.ipc.org/CleaningConfSponsorshipApp for information about the sponsorship application, and http://www.ipc.org/CleaningConfTabletopApp for the tabletop application.

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