Apr 21, 2008 As emerging technologies continue to infiltrate the electronics industry, the SMTA has organized the popular Evolving Technologies Summit to address the latest trends in electronics manufacturing and assembly. The Evolving Technologies Summit will take place on Monday, August 18th, from 8:00AM � 5:00PM and will consist of three paper sessions, a keynote address, and a concluding panel discussion.
The first session, University Research chaired by Lars Boettcher, /Fraunhofer IZM/, will feature papers on Applicability of Inkjet Technology for Electronics Manufacturing, Thermal-Analysis of a Silicon-Platform-Based Optoelectronic Multi-Chip Module, and Sintering of Ag Nano Particle Inks for Printed Electronics
The next session, Time for Paradigm Shifts, will feature papers on Electrostatic Discharge, The Future of Cameras for Mobile Electronics, and Transfer Printing. The session will be chaired by Ken Gilleo, Ph.D., /ET-Trends LLC./
The keynote address, �Solderless Assembly of Electronics � Technical Pipe Dream or Wave of the Future?� will be given by Joseph Fjelstad, /Verdant Electronics./ This talk will describe the solderless assembly process and some of its many prospective variations and benefits that could well pave the way to less costly, more environmentally responsible, higher performing and more reliable electronics assemblies.
The third session, Embedded Technologies: Their Applications and Reliability, chaired by Steve Greathouse, /Plexus Corp./, will feature papers on Embedded Chip Packages, Advanced Packaging Technologies, Use of Buried Capacitance Layers, and Reliability Testing of Advanced Semiconductors Using Embedded Chip Build-Up (ECBU) Packaging Technology.
Moderated by Reza Ghaffarian, Ph.D., /Jet Propulsion Laboratory/, the panel discussion will feature key industry participants who will respond to audience and moderator questions about current and future technology.
For more information, contact SMTA Executive Administrator JoAnn Stromberg, 952-920-7682 or joann@smta.org.
The SMTA is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.
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