SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from Polyonics, Inc.

Polyonics' XF-546 Polyimide Label Stock Wins a 2008 NPI Award

Apr 07, 2008

WESTMORELAND, N.H.  March 31, 2008  The leader in harsh environment label materials for product marking and industrial identification, Polyonics Inc., announces that it has been awarded a 2008 NPI Award in the Labeling category for its XF-546 Thermal Transfer Printable White Polyimide Label Stock. The award was presented to the company during a Monday, March 31, 2008 ceremony that took place in the Mandalay Bay Resort & Convention Center in Las Vegas before the start of APEX 2008.

Polyonics XF-546 is a polyimide label material with a permanent pressure silicone adhesive and a high opacity, medium gloss white topcoat specifically designed for thermal transfer printing. The printed polyimide label resists smearing, so no labels will have to be replaced or reprinted, speeding up the process.

The printed polyimide label resists smearing, even when the board and label are directly removed from a reflow or wave solder environment. When matched with the appropriate ink ribbon the labels are compatible with all of the leading cleaning chemistries on the market today so they can be cleaned right along with the board, saving time.

Each polyimide label produced has excellent resistance to harsh fluxes, cleaners, saponifiers, and wave solder environments, and resists all commonly used methods of cleaning Additionally, the labels can withstand process temperatures up to 1,000°F (538°C), depending on time exposure..

The labels are approved for lead-free applications, and have high PCS and barcode label first read rates.

Premiering in 2008, the NPI Awards program is an annual celebration of product excellence in electronics surface mount assembly. Premier products based on the finest examples of creative advancement in technology are chosen by a distinguished panel of industry experts.

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