SMT, PCB Electronics Industry News

Polyonics' XF-546 Polyimide Label Stock Wins a 2008 NPI Award

Apr 07, 2008

WESTMORELAND, N.H.  March 31, 2008  The leader in harsh environment label materials for product marking and industrial identification, Polyonics Inc., announces that it has been awarded a 2008 NPI Award in the Labeling category for its XF-546 Thermal Transfer Printable White Polyimide Label Stock. The award was presented to the company during a Monday, March 31, 2008 ceremony that took place in the Mandalay Bay Resort & Convention Center in Las Vegas before the start of APEX 2008.

Polyonics XF-546 is a polyimide label material with a permanent pressure silicone adhesive and a high opacity, medium gloss white topcoat specifically designed for thermal transfer printing. The printed polyimide label resists smearing, so no labels will have to be replaced or reprinted, speeding up the process.

The printed polyimide label resists smearing, even when the board and label are directly removed from a reflow or wave solder environment. When matched with the appropriate ink ribbon the labels are compatible with all of the leading cleaning chemistries on the market today so they can be cleaned right along with the board, saving time.

Each polyimide label produced has excellent resistance to harsh fluxes, cleaners, saponifiers, and wave solder environments, and resists all commonly used methods of cleaning Additionally, the labels can withstand process temperatures up to 1,000°F (538°C), depending on time exposure..

The labels are approved for lead-free applications, and have high PCS and barcode label first read rates.

Premiering in 2008, the NPI Awards program is an annual celebration of product excellence in electronics surface mount assembly. Premier products based on the finest examples of creative advancement in technology are chosen by a distinguished panel of industry experts.

Feb 10, 2012 -

Polyonics Adds New Double-Coated Polyimide Options to its Family of High Temperature Engineered Tapes

Oct 03, 2011 -

Polyonics Tapes Protect Components From Harsh Environments

Mar 17, 2011 -

Polyonics Introduces XF-604, a Flame Retardant Polyester Label Material

Nov 24, 2010 -

Protective Overlays for Flexible Electronics

Apr 11, 2010 -

POLYONICS’ TRIBOGARD® Anti-static Label Materials Win a 2010 NPI Award

Mar 06, 2010 -

POLYONICS WINS GLOBAL TECHNOLOGY AWARD

Nov 11, 2009 -

Polyonics’ ProductSentry Wins a 2009 Global Technology Award

May 26, 2009 -

ProductSentry� - Brand Protection wins Award at APEX 2009

Apr 15, 2009 -

Polyonics to Debut New Technologies at SMTA Atlanta

Apr 15, 2009 -

Polyonics Premiers Four New Materials

7 more news from Polyonics, Inc. »

May 13, 2024 -

Siborg Systems Inc Presents First-Ever Multilingual LCR-meter at DMEMS Electronic Trade Show in Del Mar, California, Now Offered by DigiKey and Amazon Worldwide

May 13, 2024 -

Comtree to Present Kurtz Ersa's Proven IR Rework Technology at the SMTA Ontario Expo

May 13, 2024 -

GEN3's Graham Naisbitt Speaks with Nolan Johnson on the Crucial Topic of Objective Evidence and the New IPC J-STD-001 Standard

May 13, 2024 -

Inovaxe Appoints Jorge Gonzalez as Mexico Regional Sales Manager to Drive Continued Growth

May 13, 2024 -

Silicon Mountain Unveils New Website to Enhance Customer Experience

May 13, 2024 -

SHENMAO's PF606-P276 Ultra-Low Void Paste Ensures High Joint Strength

May 13, 2024 -

ZESTRON Offers Free Webinar on Advancements in Solder Paste Printing

May 13, 2024 -

Symposium on Counterfeit Parts & Materials Program Finalized

May 13, 2024 -

Kurtz Ersa to Showcase Innovative IR Rework Technology at EPTECH Vancouver 2024

May 13, 2024 -

KYZEN's Adam Klett to Keynote at SMTA Electronics in Harsh Environments Conference

See electronics manufacturing industry news »

Polyonics' XF-546 Polyimide Label Stock Wins a 2008 NPI Award news release has been viewed 721 times

High Throughput Reflow Oven
Benchtop Fluid Dispenser
Manufacturing Software

Jade Series Selective Soldering Machines