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SEHO Presents New Reflow Technology at APEX 2008

Mar 11, 2008

SEHO Systems, one of the leading manufacturers of soldering systems, is contributing a paper, "New Technology to Meet Challenging Reflow Requirements", to the technical conference at IPC Printed Circuit Expo/APEX/Designers Summit, April 1-3, 2008, in Las Vegas.

The paper will be presented by Christian Ott, senior sales and project manager, in the session "Reflow Assembly" on April 2.

SEHO will provide an insight into the research project 'Microflow' which is funded by the German Federal Ministry of Education and Research. This project features a new technology which combines convection reflow soldering and microwave heating in a simultaneous process. Target is a thermal release of the assemblies by means of selective heating with electromagnetic waves, which allows the solder paste deposit to be heated stronger and faster than the temperature-sensitive components and substrates.

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