SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from Finetech

FINEPLACER� Application Packages for Advanced Rework � PoP/Underfill/01005/Single Ball

Nov 27, 2007

FINETECH application packages offered for FINEPLACER� rework systems provide an easy way to enhance the machine�s scope of application. These packages include custom-tailored modules and tools to ensure perfect results for special rework applications. This way it is possible to upgrade a standard component rework system into an advanced rework station. Modified or expanded application requirements will no longer force you into acquiring a new rework machine as it is possible to simply adapt the existing system configuration with the suitable application package. This saves both time and money!

FINETECH application packages provide solutions for crucial challenges brought to the table by specific advanced rework applications, as they ensure reduction of thermal stress, protection of (neighboured) components or economic use of inert gas. For example, the application package �Mobile Device� is specially tailored to the needs of mobile device rework, i.e. mobile phones, game consoles or notebooks. The whole rework process � desoldering and solder removal, paste printing or dispensing, soldering of the new component � can be conducted using only one machine. Typical applications are rework of QFN, PoP, Small Passives or even complete modules (i.e. Bluetooth, WiFi, cameras) in lead-free and lead-containing environments.

A currently much sought-after application is rework of underfilled components. With regard to adequate underfill materials, unique preprocessing methods as well as special tooling developed by FINETECH make for a safe and reproducible rework

The application package �Micro Rework� is dedicated to processes which � because of the small dimensions - extend into the field of micro assembly. This includes applications like rework of 01005 Small Passives (250 �m x 125 �m edge length) or the repair of single solder balls on a BGA. These applications require high alignment and placement accuracy as well as an intelligent thermal management.

Safe and reproducible rework even of sophisticated components has a name - FINEPLACER�.

More information available at


FINETECH is a leading manufacturer of innovative rework and micro assembly equipment for the latest advanced packages. The modular design of the FINEPLACER� platform enables a multitude of applications, from reworking SMDs to the highly accurate placement of flip chips or opto-electronic components. FINETECH is headquartered in Berlin, Germany, with offices in Tempe, Arizona, and Shanghai, China.

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