FINETECH application packages provide solutions for crucial challenges brought to the table by specific advanced rework applications, as they ensure reduction of thermal stress, protection of (neighboured) components or economic use of inert gas. For example, the application package �Mobile Device� is specially tailored to the needs of mobile device rework, i.e. mobile phones, game consoles or notebooks. The whole rework process � desoldering and solder removal, paste printing or dispensing, soldering of the new component � can be conducted using only one machine. Typical applications are rework of QFN, PoP, Small Passives or even complete modules (i.e. Bluetooth, WiFi, cameras) in lead-free and lead-containing environments.
A currently much sought-after application is rework of underfilled components. With regard to adequate underfill materials, unique preprocessing methods as well as special tooling developed by FINETECH make for a safe and reproducible rework
The application package �Micro Rework� is dedicated to processes which � because of the small dimensions - extend into the field of micro assembly. This includes applications like rework of 01005 Small Passives (250 �m x 125 �m edge length) or the repair of single solder balls on a BGA. These applications require high alignment and placement accuracy as well as an intelligent thermal management.
Safe and reproducible rework even of sophisticated components has a name - FINEPLACER�.
More information available at http://www.finetech.de
FINETECH is a leading manufacturer of innovative rework and micro assembly equipment for the latest advanced packages. The modular design of the FINEPLACER� platform enables a multitude of applications, from reworking SMDs to the highly accurate placement of flip chips or opto-electronic components. FINETECH is headquartered in Berlin, Germany, with offices in Tempe, Arizona, and Shanghai, China.