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Essemtec to Exhibit New Reflow Oven at Productronica 2007

Nov 01, 2007

Essemtec AG, a leading manufacturer of surface mount technology production equipment, announces that it will introduce RO-VARIO, a reflow oven with a new, flexible concept, in booths A5-277 and A5-278 at the upcoming Productronica 2007 exhibition and conference scheduled to take place November 13-16, 2007 at the New Munich Trade Fair Center in Munich, Germany.

The new RO-VARIO is a reflow oven for soldering and curing featuring remarkable flexibility and reliability. The customer profits from the oven's flexibility as well as the number of heating zones and the fact that the zone type can be selected to exactly fit customer requirements. In operation, the customer can use the oven in a various ways - even multiple different jobs can run in parallel.

For substrate transportation either a mesh belt, chain or chain over mesh can be selected. Multiple transport and support rails can be installed in parallel. A unique select-and-lock system that uses only one single motor enables the automatic positioning of each rail. Therefore, changeover is both quick and flexible. The maximum substrate width is 600 mm (23.6"), which can be used for one single substrate or for different jobs in parallel.

The concept of the RO-VARIO guarantees much higher reliability than other reflow ovens because the RO-VARIO uses fewer motors. Only one motor drive is required for a complete group of air fans (upper/lower). As an example, the breakdown probability of a RO-VARIO with nine zones is nine times lower than for other nine zone ovens. Therefore, MTBF can be expected to be nine times longer.

The oven offers a highly accurate regulation of zone temperature and an innovative air guidance system. The temperature profile can be programmed and regulated in very tight limits, which is a prerequisite for high-speed lead-free soldering. Of course, RO-VARIO also features all necessary options for high-speed SMT production, such as water cooling, nitrogen inert atmosphere and flux management.

RO-VARIO also features RO-CONTROL software for increased process simulation and control. RO-CONTROL Software enables the simulation of soldering profiles at different settings and the comparison with a solder paste library. The number of profiles managed with RO-CONTROL is unlimited. The software also controls and supervises the reflow oven, ensuring a safe operation. A saved parameter set can be selected from the profile library and can be transmitted to the reflow oven. RO-CONTROL steers and supervises the oven, and the actual status is displayed on the screen. Additionally, the paste editor allows the design and save profile references for different solder pastes. These references can be used by the profile simulator for comparison. The software also has the capability to save the process changeover to a lead-free process.

The RO-VARIO with RO-CONTROL Software is built by Essemtec in Switzerland with the highest quality parts. Essemtec is a worldwide leader in the manufacture of Surface Mount Technology (SMT) production equipment. Essemtec specializes in high mix-production equipment for Printed Circuit Boards (PCB) using SMT.

Essemtec is the only manufacturer to cover the entire production process, from Printers and/or Dispensers, to Pick-and-Place and Soldering equipment. Therefore, customers benefit from unparallel knowledge and the ability to select, from a single source, a complete process solution to meet their requirements.

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