SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from Phoenix United Associates, Inc.

Finetech to Demonstrate Compact Rework System at SMTA International 2007

Oct 04, 2007

Tempe, AZ - September 24, 2007 - FINETECH announces that it will demonstrate the Fineplacer� CRS 10 compact rework system in booth 210 at the upcoming SMTA International exhibition, scheduled to take place October 9-10, 2007 in Orlando, FL.

FINETECH's complete rework station is designed specifically for customers needing a fixed configuration, with quick set up and easy operation. The rework system is most useful for small- to medium-scale series assembly or highly precise rework of soldered components on medium to large size SMD boards. Applications include BGA, CSP, microBGA, MLF, QFP, TSOP, PLCC, small passives, connectors, RF-shields, shielding frame, flip chip rework as well as customized applications.

The rework station features a Plug-and-Work design, eliminating the need for time-consuming cabling. Additional features include a patented Vision Alignment System with stationary beam splitter, controlled Z-height during reflow, a reliable rework process, proven soldering head technology, and an automated component place and lift-off function. The Fineplacer� CRS 10 is equipped with a sophisticated Controlled Mixed Soldering System (COMISS) reflow module for top heating and high-performance full-area bottom heating.

Very high accuracy (better than 10 �m placement accuracy) allows the system to be used for the smallest components with pitches down to 100 �m. On the other hand, the large field of view makes it possible to align large components, e.g., Super BGAs with side lengths of up to 45 mm, without additional optics. Even larger components can be aligned using the company's Split Field Optics "MIRAGE".

Additional characteristics include lead-free approved, very high reproducibility, no operator influence during the process, compact design, low cost of ownership and much more.

About Finetech

Finetech is a leading manufacturer of innovative Rework and Micro Assembly equipment for the latest advanced packages. The core businesses of Finetech are devoted to the fields of precision Component Placement, Flip Chip and Opto-electronic Bonding and SMT Rework. Finetech is headquartered in Berlin, Germany, with offices in Tempe, Arizona, and Shanghai, China.

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