SMT, PCB Electronics Industry News

New Microscopic Thermal Imaging Camera

Jul 13, 2007

The newest version of the Micro thermal imaging system includes a new thermal imaging camera with greater sensitivity, 16 bit digital Camera Link interface, and a newly designed microscopic lens with 20�m spatial resolution.

Micro is used to detect shorts and defects on semiconductor devices and small circuit boards. It can also measure junction temperature, identify die bonding defects, and measure packaged die thermal resistance.

A Micro system includes several important hardware components that are essential when analyzing or troubleshooting semiconductor devices. The optical mounting table provides a sturdy platform with vibration isolation on which to perform sensitive testing. Precise camera focusing and positioning is accomplished using the vertical focus stage. Areas of interest on a device can be quickly and accurately positioned within the camera�s field-of-view using the XY stage. The thermal stage provides both heating and cooling for precise device temperature control in order to locate short circuits and to compensate for pixel emissivity variations.

Nov 26, 2012 -

OptoTherm introduces IR LabMate infrared camera

Oct 31, 2012 -

OptoTherm names sales rep in Indonesia, Phillipines, Singapore, Thailand, and Vietnam

Oct 03, 2011 -

OptoTherm names sales rep in Malaysia

Jan 19, 2011 -

OptoTherm adds Tianjin Felles Photonic Instruments as sales representative in China

May 30, 2008 -

OptoTherm offers environmental enclosure for EL system

Mar 18, 2008 -

EL thermal imaging system camera upgrade

Oct 04, 2007 -

OptoTherm adds DVS-India as sales representative in India

Mar 16, 2007 -

OptoTherm releases PCB Test Arm Probe

Jun 22, 2017 -

Addressing The Modulation of Light Output -- High Quality LED Manufacturing

Jun 22, 2017 -

Schleuniger, Inc. Receives 2017 Best of Manchester Award

Jun 21, 2017 -

Inovar Inc. Breaks Ground for New Facility on USU Innovation Campus

Jun 21, 2017 -

PNC Inc. Launches Design Webinar Series

Jun 21, 2017 -

Saelig Introduces Mercury™ T2C USB 2.0 & Power Delivery Protocol Analyzer With Type-C Connection

Jun 20, 2017 -

Europlacer Secures Fourth Award from Industry Analysts Frost & Sullivan.

Jun 20, 2017 -

In Memory of Jim D. Raby, PE

Jun 20, 2017 -

Micro-Focused IR Thermal Testing with PDR's Focused IR

Jun 20, 2017 -

SCS to Present ‘Using Conformal Coatings to Mitigate System Failures’ during upcoming Webinar

Jun 20, 2017 -

Vitronics Soltec Soldering Equipment to be represented by DiversiTech in S. CA, S. NV and Baja, Mexico

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