Excerpt from IPC-7526:
"This Handbook addresses the removal of solder paste and uncured/unreacted SMT adhesives from stencils, misprinted circuit boards (PCBs) and application tools connected to the soldering paste application process.
The purpose of this handbook is to provide a basic understanding of stencil/misprint cleaning processes. The handbook serves as a guide to users or prospective users of stencil/misprint cleaning technology."
Smart Sonic proudly endorses the new IPC Stencil and Misprinted Board Cleaning Handbook and strongly suggests that all current and prospective users of stencil cleaning technology obtain a copy as "an informed buyer becomes a satisfied customer.�
Smart Sonic introduced the original ultrasonic stencil cleaner and manufactures the only stencil cleaning system that has been verified for specific parameters of environmental safety, user safety and cleaning efficiency by the U.S. EPA�s Environmental Technology Verification Program.
For a free copy in PDF format go to: http://www.SmartSonic.com/article.html .