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Endicott Interconnect Technologies, Inc. to Participate at ECTC and IMAPS Conferences

May 31, 2006

Endicott Interconnect Technologies, Inc. today announced they have been selected to participate in the 56th ECTC Conference and the 3rd Topical Workshop and Tabletop Exhibition on Military, Aerospace, Space & Homeland Security: Packaging Issues & Applications (MASH 2006).

The 56th Electronic Components and Technology Conference (ECTC) is the premier international packaging, components and microelectronic systems technology conference and will be held in San Diego, California, May 30 - June 2, 2006. This year�s conference offers 38 technical sessions containing white papers covering leading edge developments and technical innovations across the packaging spectrum.

EI participants will include Varaprasad Calmidi, Advisory Engineer presenting �Thermal Enhancement of Systems using Flip Chip Packages with an Alternate Cooling Path through the PCB�; Rabindra N. Das, Senior Advisory Technologist, talking about �Electrical Conductivity and Reliability of Nano and Micro-Filled Conducting Adhesives for Z-Axis�; �High Capacitance, Large Area, Thin Film, Nanocomposite-Based Embedded Capacitors� will be presented by Mark D. Poliks, Senior Advisory Technologist and ECTC Advanced Materials Session Co-chair; and the final paper by EI Senior Associate RF Engineer, Michael J. Rowlands is entitled �Simulation and Measurement of High Speed Serial Link Performance in a Dense, Thin Core Flip Chip Package�.

�These technical conferences offer EI the opportunity to share in technological discussions and exchange ideas with industry experts from top firms and universities all over the world,� commented Voya R. Markovich, Senior Vice President and Chief Technology Officer at EI and ECTC Innovated Interconnection Session Co-chair and Interconnection Session Co-chair.

The International Microelectronics and Packaging Society (IMAPS) is sponsoring the 3rd Topical Workshop and Tabletop Exhibition on Military, Aerospace, Space & Homeland Security: Packaging Issues & Applications (MASH 2006) to be held June 6 - 8, 2006 in Washington, D.C. This technical program will focus on work being done to advance the state-of-the-art in high reliability electronics packaging for military and homeland security applications.

EI participants will include Subahu D. Desai, Senior Advisory Technologist, presenting �High Reliability Products � What does it really take? � A Test Perspective�; Voya R. Markovich, Senior Vice President and Chief Technology Officer, speaking about �Trends in Organic Packaging / EI Roadmap and Vision�; and Kim J. Blackwell, Senior Advisory Product Manager, Semiconductor Packaging, talking about �Organic Flip Chip Packages for use in Military and Aerospace Applications�.

About Endicott Interconnect Technologies

Endicott Interconnect Technologies, Inc., with headquarters in Endicott, NY, is a world-class supplier of electronic interconnects solutions consisting of fabrication and assembly of complex PCBs, advanced flip chip and wire bond semiconductor packaging as well as precision equipment manufacturing and integration. EI product lines meet the needs of markets including IT, telecommunications, advanced test equipment, medical, power management, defense and aerospace, where highly reliable products built in robust manufacturing operations are critical for success. With more than 40 years experience in providing microelectronics solutions, the company brings to market a unique mix of leading edge technology and technical know how that provide customers with a time-to-market advantage and competitive differentiation. For more information about EI and its products, please visit http://www.endicottinterconnect.com.

Company Contact:

Theresa Taro

Director of Marketing and Communications

Phone: (607) 755-1847

Theresa.Taro@eitny.com

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