Dr. Liu�s presentation will emphasize the effects on finished goods reliability attributable to: solder alloys, surface finishes, the microstructure of lead-free joints, mixed alloy compatibility, and alloy converging. She will also discuss the failure mechanisms of grain boundary sliding and cavitation, grain and IMC size, Kirkendall voiding and fragile SAC joints.
Dr. Liu has a Ph.D. from Salford University in the United Kingdom. She is based at Indium Corporation�s Global R&D Center in Clinton, NY.
Indium Corporation is a three-time Frost & Sullivan Award-winning supplier of electronics assembly materials, including solder pastes, solder preforms, fluxes, Pb-Free solder alloys, underfill materials, die-attach materials, and more. The company is also the world�s premiere supplier of commercial grade and high-purity indium. Factories are located in the USA, the United Kingdom, Singapore, and China. Founded in 1934, the company is ISO 9001 registered.
For more information and to register for the presentation visit SMTA/CAVE Harsh Environments Electronics Workshop