Jan 11, 2005
His course will cover all the fundamental design considerations of Pb-Free alloys, with emphasis on metallurgical properties analysis. The performance of representative alloys on reflow soldering will be discussed, along with major challenges, with a focus on metallurgical causes.
Dr. Lasky�s topic is �Best Practices in Implementing Lead-Free Assembly� and he will also be presenting on Monday, February 21 from 8:30 a.m. � 4:30 p.m. Dr. Lasky, a holder of the prestigious SMTA Founder�s Award, is a world-renown process expert and visiting professor at Dartmouth College. He has over 20 years of experience in electronic and optoelectronic packaging and assembly.
His course will focus on all the �how to�s� of implementing Pb-Free. It covers every issue, such as PCB finishes, components, alloys and SMT processes. It also reviews several actual implementations of Pb-Free processing and will conclude with a Pb-Free implementation plan to be used by July 1, 2006.
Indium Corporation is a three-time Frost & Sullivan Award-winning supplier of electronics assembly materials, including solder pastes, solder preforms, fluxes, Pb-Free solder alloys, underfill materials, die-attach materials, and more. The company is also the world�s premiere supplier of commercial grade and high-purity indium. Factories are located in North America, Europe, and Asia. Founded in 1934, the company is ISO 9001 registered.
For more information about Pb-Free issues visit Indium Corporation of America at http://www.pb-free.com or email askus@indium.com.
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