SMT, PCB Electronics Industry News

Kit Checks Out Pick-and-Place Equipment

Jun 18, 2003

The IPC-9850 test materials kit includes all the materials needed for manufacturers to test flexible placement machines and chip shooters to the specifications of the IPC-9850 standard, the important new industry standard for all pick-and-place equipment characterisation.

The IPC has developed the 9850 standard to encompass the parameters, measurement procedures and methodologies used for the specification, evaluation, and continuing verification of surface mount placement equipment.

It establishes the procedures to characterise and document the placement capability and performance of surface mount assembly equipment.

The IPC-9850 standard was developed by the SMT Component Placement Equipment Subcommittee of the Assembly Equipment Committee of the IPC.

Technology Information Corporation certifies that the IPC-9850 test materials kit meets the highly demanding specifications of the IPC-9850 standard.

Technology Information Corp

http://www.techinfocorp.com

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