SMTA International to Feature Seventeen New Courses

MINNEAPOLIS, MN... SMTA is again co-locating its annual conference, SMTA

International, with the Assembly Tech Expo (ATExpo) show this fall at the

Donald Stephens Convention Center in Rosemont, Illinois (Conference:

September 21-25 Exhibits: September 23-25).

This year's program will feature thirty full- and half-day short

courses. Seventeen are entirely new courses on today's most important

topics in electronics manufacturing, assembly, and related business issues:

Lean Manufacturing

Moisture Sensitive Devices

Quality Improvements in SMT Assembly

Design for Advanced IC Package Technology

High Density Manufacturing

Lead-free Implementation

Lead-free Solder Joint Reliability

PPM/DPMO Benchmarking

Competitive Advantage in Today's EMS Market

Low Volume SMT Assembly

Mastering BGA Processing & Rework - HANDS ON COURSE

0201 Design, Assembly, & Soldering

Low Cost & Advanced Flip Chip Technology & Processing

PWB Yield Management for Increased Profitability

Pin-in-Hole / Intrusive Reflow Design & Assembly

Selective Soldering

Outsourcing Lead-free Assembly

Featuring SMT, Flip Chip, MEMS, Chip Scale, BGA, Automotive, Lead-free,

Process Control and more, SMTA International is dedicated to surface mount,

advanced packaging, and related technologies. Led by conference chair Rob

Rowland, RadiSys Corporation, the highly regarded SMTA International

Technical Advisory Committee is comprised of electronics manufacturing and

packaging experts who represent all facets of the industry.

For developing information on SMTA International, visit the on-line

conference brochure at smta.org/smtai or contact SMTA administrator JoAnn

Stromberg at 952-920-7682 or joann@smta.org.

http://www.smta.org/smtai/index.cfm

The SMTA membership is a network of professionals who build skills, share

practical experience and develop solutions in electronic assembly

technologies and related business operations.