Mar 20, 2003
Under the direction of conference chairman Dr. Paul T. Vianco of Sandia National Labs, the SMTA (Surface Mount Technology Association) is organizing a Flip Chip and BGA Packaging Technologies Workshop as a part of the SMTA Boston 2003 Conference (June 9-11) at the Bayside Convention Center in Boston, Massachusetts.
The Flip Chip and BGA Packaging Technologies Workshop will focus on three topics: Assembly Processes for Flip Chip and BGA, Materials Systems for Area Array Packaging, and Reliability of Flip Chip and BGA Packages and Interconnects. Information based upon laboratory research and development studies, actual product applications, and failure analysis case studies will be featured in this event.
A highlight of the program will be a keynote address by industry expert Peter Elenius of E&G Technology Partners on What Is or Is Not Driving Flip Chip and Wafer Level Package Adoption.
Presentations, rather than papers, will comprise a workshop format to allow more time for interaction, questions, and answers. The workshop session for each topic will begin with an overview followed by the detailed presentations, which describe state-of-the-art technology and future trends.
Visit the Symposia Page of the Education section on http://www.smta.org for full details on the SMTA Boston Flip Chip and BGA Packaging Technologies Workshop.
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