Equipment will include the PacLine 2000 A50, which is capable of bumping 600K wafers/year, according to Dr. Thorsten Teutsch, CTO. Pac Tech will employ its new SB2-Jet solder ball equipment for solder ball bumping at the facility. [pactech.de]
Jan 27, 2003
Equipment will include the PacLine 2000 A50, which is capable of bumping 600K wafers/year, according to Dr. Thorsten Teutsch, CTO. Pac Tech will employ its new SB2-Jet solder ball equipment for solder ball bumping at the facility. [pactech.de]
SMTnet Names David Fish (aka "davef") Technical Editor of SMT Express & Ombudsman of SMTnet Forums. |
|
PCB East 2003 Announces Final Conference and Exhibition Program |
More news from electronics manufacturing industry »
See electronics manufacturing industry news »
Pac Tech USA Offering Contract Wafer Bumping, Stencil Services news release has been viewed 648 times