Oct 23, 2023 
SHENMAO America, Inc. is proud to introduce its latest breakthrough in soldering technology, the PF606-P276 Ultra-Low Void No-Clean Zero-Halogen Lead-Free Solder Paste. With its exceptional performance, eco-friendly attributes, and adaptability to a wide range of applications, PF606-P276 boasts a series of remarkable features and benefits that set it apart from conventional solder pastes.
PF606-P276 offers superior void performance achieved through special activators, making it the preferred choice for high-reliability soldering applications. This solder paste is halogen-free (ROL0) and fully compliant with international environmental standards like RoHS, RoHS 2.0, and REACH, underscoring its eco-friendly credentials.
Additionally, PF606-P276 excels in solderability, ensuring flawless connections in Surface Mount Technology (SMT) processes. Its remarkable wettability characteristics guarantee a uniform soldering process, while its design for high-speed printing optimizes production efficiency. When reliability is of the essence, PF606-P276 shines with its superior solder joint strength and product performance that consistently surpasses expectations.
PF606-P276 is designed for Lead-Free No-Clean Solder Paste, tailored for Surface Mount Technology (SMT) applications. It excels in minimizing gas generation during the reflow process, achieving a void ratio of less than 10% in critical components like MOS and QFN.
This versatile solder paste is suitable for general SMT applications and is particularly well-suited for demanding automotive products with stringent reliability requirements.
SHENMAO's commitment to innovation and quality is showcased through PF606-P276, as it continues to drive technological advancements in the electronics manufacturing industry. With this new solder paste, SHENMAO offers a solution that ensures high-performance, eco-friendliness, and the reliability required by modern electronics manufacturers.
For more information, please visit www.shenmao.com.
SHENMAO is dedicated to the production of solder products including Water Soluble and No-clean Solder Paste, Laser Solder Paste, Solder Preforms, Cored Solder Wire, Wave Solder Bar Alloys, Wave Soldering Fluxes, Extremely Pure Solder Powder up to Type 8, BGA and Micro BGA Solder Sphere, Wafer Level Packaging Solder Paste and Fluxes, LED Die Attach Paste, High Performance Liquid Fluxes, Solder Preform, Solar Ribbon, Plating Anode used in PCB Fabrication, Assembly and Semiconductor Packaging Processes.
