Oct 11, 2022 
SHENMAO America, Inc. has successfully developed a no-clean high thermal impact reliability solder paste. PF918-PW216 solder paste adopts the newly designed high reliability lead-free alloy (Sn/4Ag/3Bi) that achieves tensile strength performance 1.4 times higher than typical SAC305 alloys.
According to the cleaning process requirements of some customers, PF918-PW216 is a specially designed solder paste that is cleanable with water. Additionally, PF918 has superior thermal cycling reliability performance suitable for automotive devices and high-power components with high thermal reliability requirements. Board-level thermal cycling test results with a real automotive IC product show that the thermal cycling life of PF918 is twice as long as the SAC305 alloy.
PF918-PW216 is halogen-free (ORH0) and complies with RoHS. RoHS 2.0 and REACH. The innovative flux design provides excellent voiding performance. The paste has a similar melting point to SAC305 so that the regular SAC305 reflow profile can be applied.
PF918-PW216 is designed for consumer electronics, servers, automotive electronics and long service life electronic products with high reliability requirements.
For more information, please visit www.shenmao.com.
SHENMAO is dedicated to the production of solder products including Water Soluble and No-clean Solder Paste, Laser Solder Paste, Solder Preforms, Cored Solder Wire, Wave Solder Bar Alloys, Wave Soldering Fluxes, Extremely Pure Solder Powder up to Type 8, BGA and Micro BGA Solder Sphere, Wafer Level Packaging Solder Paste and Fluxes, LED Die Attach Paste, High Performance Liquid Fluxes, Solder Preform, Solar Ribbon, Plating Anode used in PCB Fabrication, Assembly and Semiconductor Packaging Processes.
