Apr 20, 2022 
From 3D SPI to 3D AOI and 3D Bond to 3D AXI and 3D MXI, Viscom AG will showcase a wide range of innovative solutions for intelligently networked quality control at the SMTconnect international trade fair for electronics manufacturing. A special highlight features new remote service offerings under the vConnect brand. At PCIM Europe, where power electronics are in the foreground, Viscom is particularly featuring 3D AXI.
As one of the world's leading manufacturers of optical and X-ray inspection systems for the electronics industry, Viscom is a reliable partner when it comes to meeting the highest requirements for manufactured products. From motor control units to inverters and rectifiers to cell phones and small wearables – the focus is on product safety in particular, in addition to the longest possible functionality. Inspection in electronics manufacturing is continuously evolving. Intelligent transport concepts, excellent handling times, all-around informative inspection results, and fully comprehensive vertical and horizontal networking are very decisive factors.
One of the key topics that Viscom will be presenting at SMTconnect in Nuremberg from May 10 to 12, 2022 at Stand 4A-120 will be offerings from the remote-services area under the new vConnect brand. Viscom has continuously advanced the underlying developments in recent years and tested them extensively in technology partnerships with selected customers. Thanks to the successful completion of pilot installations, very valuable experience is available on the versatile capabilities of these products. With vConnect, important tasks such as condition monitoring and predictive maintenance can be solved particularly smartly and efficiently for the machines and processes used in modern production lines. In addition, large volumes of image data can be archived in unprecedented form for the optimization of inspection programs and these can also be used for AI training.
Among other benefits, artificial intelligence can make a significant contribution to accurately segmenting voids in solder joints detected by X-ray in order to provide repeatable measurements and evaluations for optimal quality assurance and process control. In fast and highly accurate fully automated inline X-ray inspection, Viscom sets new standards with its iX7059 systems. At SMTconnect, the company will show the iX7059 PCB Inspection XL 3D AXI system for very long PCBs from this series. The X-ray offering at the Viscom stand is rounded out with the extremely fast X7056-II 3D AXI/3D AOI combination system and the new X8011-III 3D MXI system, which is a highly flexible offline team player with first-class automation and documentation options, plus other features. Advances in the field of 3D AOI will be presented by the company's experts on the S3088 ultra gold system. 3D solder paste inspection – with its capabilities of the most accurate measurement and closed-loop communication – can be demonstrated on the S3088 ultra chrome SPI system. The S6053BO-V system is equipped with the latest 3D bond sensor technology at the trade show to demonstrate to interested visitors the advantages of exact height information in this special area.
Besides participating at SMTconnect, Viscom will also be exhibiting for the first time at PCIM Europe (Stand 6-110), which is taking place at the same time on the same exhibition grounds. There, the company's contact persons will focus in particular on inspection requirements for objects from the field of power electronics, where increasingly complex products (with the corresponding heat sinks and thus more potential interference structures during X-ray) require exceptionally high-performance inspection systems. With the iX7059 Module Inspection, Viscom is presenting at its PCIM stand precisely the 3D AXI system that is capable of meeting these increased requirements for automated inline inspection.
It is therefore clear to see: Parallel participation in both events in Nuremberg corresponds to the growing variety of inspection objects that Viscom as a company covers with its systems. Today, industries such as electromobility, renewable energies, telecommunications and consumer electronics benefit from the wide range of handling and inspection technologies available here with their various products.
Founded in 1984, Viscom AG is one of the leading suppliers worldwide in the field of assembly inspection within electronics production. With its headquarters and production site in Hanover, Germany, the company develops, produces and sells high-quality inspection systems from the areas of AOI, SPI, AXI, MXI, wire bond inspection as well as conformal coating inspection. The systems developed and manufactured in Hanover set high standards in terms of accuracy and speed. The product range covers the complete spectrum of optical inspection and X-ray inspection for small and medium-sized companies as well as for large series production. Viscom systems are used for 100% automatic inspection of electronic assemblies such as those used in the production of automotive electronics, aerospace technology or in the manufacture of telecommunications electronics.
Product development also focuses on customer-specific system developments and networking with other production processes for smart factory applications. In order to achieve this, Viscom AG increasingly invests in its own software and hardware development which is constantly defining new standards in inspection technology.
International sales are handled by a broad network of its own subsidiaries, application centers, service centers and representatives. A service team of in-house technicians and application specialists commission Viscom systems worldwide, offering maintenance, conversion and modernization from a single source. In addition, system-specific training courses are offered for customers’ operators, programmers and maintenance personnel. Experienced engineers and technicians from the application and service departments share their expert knowledge with participants.
Viscom AG has been listed on the Frankfurt Stock Exchange since 2006 (ISIN: DE0007846867).
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