Sep 06, 2020 
Indium Corporation’s Iván Castellanos, Technical Services Manager for Latin America, will host an Avoid the Void® InSIDER Series workshop on how to avoid voiding in bottom termination components (BTCs) on Tuesday, September 22 at 12 p.m. Central Time (Mexico)/7 p.m. Central European Summer Time (Madrid, Spain).
BTCs are one of the most common packages in electronics today with the highest growth rate due to their small size, excellent electrical performance, and ability to transfer heat away from the integrated circuit (IC). In this workshop, Understand and Troubleshoot Voiding in Bottom Terminated Components, Castellanos will discuss how voids form in QFNs and how to minimize them. He’ll also cover factors that affect voiding, such as stencil design, stencil thickness, reflow profile, solder paste particle size, and solder pastes. The use of solder preforms to minimize voiding will also be presented.
Indium Corporation’s InSIDER Series is a free program designed to deliver expert technical content, share industry knowledge, and promote professional growth using a virtual platform. Current and future webinars can be found at www.indium.com/webinar.
Castellanos provides support for electronics assembly, semiconductor and advanced assembly, and thermal management markets. He is based in Guadalajara, Jalisco, Mexico, and has more than 25 years of experience in electronics assembly manufacturing, including SMT production troubleshooting. Castellanos has a diploma in electronics and communications engineering and is a Certified SMT Process Engineer (CSMTPE). He is the SMTA instructor for the certification program in Spanish. He has also earned his Six Sigma Green Belt from Dartmouth College's Thayer School of Engineering. Castellanos has worked for several major manufacturing companies, including Jabil Circuits in Guadalajara, Jalisco, Mexico. In addition, he has presented at numerous technical conferences and customer sites.
To register for Castellanos’ webinar, visit www.indium.com/webinar. The webinar link will be shared with registrants the day of the event. Registrants must use a company email account to avoid Indium Corporation’s spam filters. This is a first-come, first-served event.
Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email jhuang@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
