SMT, PCB Electronics Industry News

SHENMAO America to Participate in the eSMART Factory Conference

May 20, 2018

SHENMAO America, Inc. today announced plans to exhibit at the eSMART Factory Conference, jointly organized by Global SMT & Packaging magazine and the SMTA, on Thursday, May 24, 2018 at the Plug ‘n Play Tech Center in Sunnyvale, CA. SHENMAO will highlight the new PF606-P245 Lead-free Zero Halogen Solder Paste. PF606-P245 paste improves ICT testability by completely removing flux to prevent contamination of test pins during test operation.

SHENMAO’s PF606-P245 is designed to lengthen stencil life and eliminate head-in-pillow (HiP) defects, voids, slumping and non-wetting opens. Minimal flux residue gathers near the outside of the solder joint on the PCB substrate – a substantial improvement over legacy solder paste. With superior continuous high-speed printability, the pastes produce first-rate solder paste print quality and a wide reflow process window for excellent solderability.

SHENMAO has successfully been approved by many international well-known electronic manufacturers. The company strives to offer the best quality without compromising cost and time-to-market while providing maximum value to all customers. As the world’s major solder materials provider, SHENMAO produces SMT solder paste, laser soldering paste, cored solder wire, wave solder bar, semiconductor packaging solder spheres, wafer bumping solder paste, flux and solar PV ribbon.

SHENMAO America, Inc. blends SMT solder paste at its facility in San Jose, CA for distribution in North America. For more information, please visit www.shenmao.com.


SHENMAO is dedicated to the production of solder products including Water Soluble and No-clean Solder Paste, Laser Solder Paste, Solder Preforms, Cored Solder Wire, Wave Solder Bar Alloys, Wave Soldering Fluxes, Extremely Pure Solder Powder up to Type 8, BGA and Micro BGA Solder Sphere, Wafer Level Packaging Solder Paste and Fluxes, LED Die Attach Paste, High Performance Liquid Fluxes, Solder Preform, Solar Ribbon, Plating Anode used in PCB Fabrication, Assembly and Semiconductor Packaging Processes.

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New High Thermal & Impact Reliability Solder and Water Soluble Flux from SHENMAO

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SHENMAO America to Show New Solder Alloy with High Thermal & Impact Reliability at SMTA Michigan Expo

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SHENMAO Technology to Exhibit New Solder Alloy with High Thermal & Impact Reliability at SEMICON Southeast Asia

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SHENMAO Technology will attend AutoTronics Taipei 2018

Jan 24, 2018 -

SHENMAO America to Solve Solder Paste Problems at APEX

Nov 28, 2017 -

SHENMAO Introduces New Generation Zero Halogen Lead-Free Solder Paste PF606-P245 to solve HoP issues and Improve ICT Testability, Sponsors MEPTEC SEMICONDUCTOR PACKAGING SYMPOSIUM November 30, 2017, E

Nov 28, 2017 -

SHENMAO Introduces New Generation Zero Halogen Lead-Free Solder Paste PF606-P245 to solve HoP issues and Improve ICT Testability

Nov 24, 2017 -

SHENMAO America, Inc. exhibits at local SMTA Exhibition at Bestronics, San Jose, CA Facility on November 29 - Introduces 2 new Solder paste formulations.

Sep 12, 2017 -

SHENMAO Introduces New Generation Lead-Free Solder Paste PF606-P140 To Solve HoP Issues and Improve ICT Testability at SMTAI Exhibition

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