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Engineered Material Systems Introduces a New Two-Component Epoxy Encapsulant (506-03A/B)

Jan 28, 2018

Engineered Material Systems, a leading global supplier of adhesives, encapsulants, and conductive materials, is pleased to debut its 506-03A/B, which is a two-component epoxy system with a convenient 1:1 volumetric mix ratio designed to pass rigorous reliability requirements.

506-03A/B is a two component, black, 100 percent solids, epoxy encapsulating compound characterized by its low mixed viscosity, quick gel (~8 minutes) and its excellent resistance to thermal shock, very good electrical properties and adhesion to a variety of substrates upon cure.

506-03A/B is the latest addition to Engineered Material Systems’ extensive line of potting/encapsulating materials that can be used in a multitude of applications to pot/encapsulate electrical and electronic assemblies.

For more information about the 506-03A/B or to learn how Engineered Material Systems can define, develop and create an engineered material solution that is right for your company, visit www.emsadhesives.com.


Engineered Materials Systems, Inc. (EMS) technology focus is on adhesives, encapsulants, and conductive materials for automotive, microelectronics, and printed inks product lines. The company creates continual improvements that will guide its customers into the future. For more information, visit www.emsadhesives.com

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