SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Engineered Material Systems to Showcase Jet Dispense SMT at IPC APEX EXPO

Engineered Material Systems to Showcase Jet Dispense SMT at IPC APEX EXPO

Jan 28, 2018

Engineered Material Systems, Inc. (EMS), a leading global supplier of conductive inks and interconnect materials for printed electronics, will exhibit its jet dispensable SMT adhesives at the 2018 IPC APEX EXPO, scheduled to take place Feb. 27 - March 1, 2018 at the San Diego Convention Center in Ca.

EMS and Essemtec have collaboratively developed a fast and accurate means to attach smaller die package to printed electronics. Essemtec's PUMA jet dispenser can accurately place adhesive dots on fine-line silver ink lands. The jetting process eliminates the need for Z-axis accuracy required for needle dispense, enabling rapid SMT attach on non-planar or 3D surfaces using high-speed laser mapping in real-time per sheet.

EMS' SMT adhesives have been optimized for accurate jet dispense and compatibility with EMS PTF inks to deliver robust circuits that withstand ASTM F3147-15 multiple mandrel flex cycles.

Essemtec's PUMA features the ability to jet dispense multiple materials (e.g. silver epoxy, staking compound, encapsulant) and pick-and-place numerous components on one platform.

The EMS and Essemtec solution is a game changer for printed PTF electronics.

For more information about EMS’ durable electronics solutions or to learn how the company can define, develop and create an engineered material solution that is right for your company, meet with company representatives in Booth #721 at the IPC APEX EXPO or visit www.emsadhesives.com.


Engineered Materials Systems, Inc. (EMS) technology focus is on electronic materials for printed electronics, semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonics assembly product lines. The company creates continual improvements that will guide its customers into the future. For more information, visit www.emsadhesives.com.

Jun 11, 2018 -

Engineered Material Systems to Showcase Next Generation Electrically Conductive Adhesives at Intersolar Europe

May 08, 2018 -

Engineered Material Systems to Showcase Conductive Adhesives for Next-Generation Solar Modules at the SNEC PV Power Expo

Mar 12, 2018 -

New Non-Conductive Die Attach Adhesive for Image Sensors & Circuit Assembly Applications

Mar 08, 2018 -

EMS Introduces Dry Film Negative Photoresist for Sealing Through-Silicon Vias in CMOS Wafers

Jan 28, 2018 -

Engineered Material Systems Introduces a New Two-Component Epoxy Encapsulant (506-03A/B)

Dec 05, 2017 -

Super Thin Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

Dec 03, 2017 -

Engineered Material Systems Introduces a New Low-Temperature Cure Electrically Conductive Adhesive

Oct 22, 2017 -

New Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

Oct 18, 2017 -

Engineered Material Systems Introduces New UV-Cured Adhesive for Bonding Lens Holders in Camera Modules

Sep 13, 2017 -

Engineered Material Systems to Showcase Liquid and Dry Film Negative Tone Photoresists at MicroTAS

58 more news from Engineered Materials Systems, Inc. »

Jul 16, 2018 -

Industry Veteran Joins Creative Electron

Jul 16, 2018 -

Connect Group Selects Aegis Software’s FactoryLogix MES Platform

Jul 16, 2018 -

Libra Industries partners with CoPro Technologies for Mechanical Design / PCB Layout

Jul 16, 2018 -

Precision PCB Services, Inc. adds Side View Camera to their BGA Rework Stations

Jul 15, 2018 -

Great Results from Europe’s First atom Platform Installation at Syselec France.

Jul 12, 2018 -

Epec Partners with Wounded Warrior Project

Jul 12, 2018 -

Lacon Electronic GmbH acquires TRI's AOI Solution for Zero Tolerance

Jul 11, 2018 -

Kurtz Ersa Inc. Expands Its North American High-Tech Demo Center

Jul 11, 2018 -

ADLINK Joins Open Networking Foundation (ONF) as Collaborating Innovator to Boost Transformation of Network Infrastructure

Jul 11, 2018 -

IPC Releases 2018 Quality Benchmark Study for Electronics Assembly

See electronics manufacturing industry news »

Engineered Material Systems to Showcase Jet Dispense SMT at IPC APEX EXPO news release has been viewed 56 times

  • SMTnet
  • »
  • Industry News
  • »
  • Engineered Material Systems to Showcase Jet Dispense SMT at IPC APEX EXPO
X-Ray Inspection Systems Scienscope

Manufacturing Software