Akrometrix, LLC, the leading provider of thermal warpage and strain metrology equipment to both the front- and back-end semiconductor and electronics industries, will display its newest warpage metrology system in Hall A3, Stand 102/1 at productronica 2017, scheduled to take place Nov. 14 – 17, 2017 at the Messe München, in Germany. The new Tabletop Shadow Moiré (TTSM) system offers all of the software features of Akrometrix’s thermal warpage metrology systems in a room temperature unit which provides full field-of-view measurement in less than two seconds.
Akrometrix is not only the industry leader in providing thermal warpage, but has optional modules for both DIC strain/CTE measurements and DFP for discontinuous surfaces. Utilizing a novel combination of both top and bottom heaters with shadow moiré, Akrometrix is providing temperature uniformity previously unattainable in the industry on a flexible/configurable platform.
The TTSM responds to the industry’s demand for an ultra-fast tabletop warpage metrology system. It enables customers to measure warpage of substrates up to 300mm x 310mm (a 300mm wafer or two JEDEC trays) with the entire measurement taking less than two seconds. Whether individual parts or a JEDEC tray of multiple parts, the TTSM provides an ultra-fast and highly accurate measurement at room temperature that is suited for tabletop use.
Akrometrix is the leader in thermal warpage and strain metrology for the front-end/back-end wafer, back-end packaging/assembly, panel and the PCB/component markets. The company provides both capital equipment and test services to measure warpage and strain in temperatures from -50°C to 300°C on virtually any substrate up to 600mm x 600mm, regardless of shape. Located in Atlanta, Georgia, Akrometrix has been serving customers worldwide for more than 20 years based on technology developed at Georgia Tech. For more information, contact Akrometrix at sales@Akrometrix.com or visit www.akrometrix.com.