Essemtec, the Swiss manufacturer of production systems for electronic assembly and packaging, today announced plans to exhibit in Booth #207 at SMTA International, scheduled to take place Sept. 19-20, 2017 at the Donald Stephens Convention Center in Rosemont, IL. The company will demonstrate the new FOX2 that combines jetting of solder paste or glue and placement in a single machine.
FOX2 has a machine footprint of just 1m2 and can accept PCB sizes up to 16 x 12". Components with sizes from 01005 up to 1.3 x 3.1"are placed. The machine achieves 10,800 cph (IPC9850) with the release of ePLACE 23 and still remains 50 µm accuracy, 3 sigma with a two nozzle head.
The new version is based on the original award-winning platform, which is the ﬁrst machine in its class with linear motors and a mineral cast frame, providing excellent speed, stability, accuracy, and making it perfectly suited for use in small to medium production environments.
For more information contact Steve Pollock at 856-218-1131, M 856-524-1110, firstname.lastname@example.org or for latest information and videos visit www.essemtec-usa.com.
Essemtec AG is a privately held Swiss equipment manufacturer, specializing in high speed fluid dispensing as well as flexible high-mix SMT placement solutions. Both divisions leverage the company’s vast equipment and process know-how gained since 1991 to let their customers achieve significant competitive advantages. The company’s goal is to improve its customers’ workflows, setup times, defect rates, traceability and overall manufacturing efficiency through superior software and by providing managed SMT storage.