SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • SHENMAO Exhibits at SEMICON WEST July 11-13, 2017 Booth # 5716 Introduces New Tacky Flux SMF-WC52 for Flip Chip Technology

SHENMAO Exhibits at SEMICON WEST July 11-13, 2017 Booth # 5716 Introduces New Tacky Flux SMF-WC52 for Flip Chip Technology

Jul 09, 2017

SHENMAO Technology, Inc. introduces New Generation Ultra Tacky Flux SMF-WC52 applied in the Flip Chip dipping process. Its high tacky property keeps Chip in place during reflow for excellent soldering performance, while creating outstanding solder joint strength.

SHENMAO introduces New Generation Lead-free Solder Paste PF606-P140 and Zero-Halogen Lead-free Solder Paste PF606-P245 with a wide process window, superior print and solderability to solve Head on Pillow issues and improve ICT testability, easily fit into complicated PCB designs through excellent convergence performance.

SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high-quality sphericity. Various diameters (0.76, 0.65, 0.64, 0.5, 0.45, 0.4, 0.3, 0.25, 0.2, 0.15, 0.1, 0.09, 0.08, 0.075, 0.07, 0.06, 0.055 and 0.05 mm Dia.- 0.045 and 0.040 mm Dia. are in development) are available in SAC305, SAC405 and SAC1205 Alloys at affordable low cost from 10 worldwide SHENMAO locations.

As the World’s Major Solder Materials Provider, SHENMAO produces SMT Solder Paste, Wave Solder Bar, Cored Solder Wire and Flux, Solder Preforms, Semiconductor Packaging Solder Spheres, Wafer Bumping Solder Paste, Dipping Flux and PV Ribbon.


SHENMAO America, Inc. www.shenmao.com Tel: 408-943-1755 e-mail: usa@shenmao.com To Register: https://www.xpressreg.net/register/semi0717/landing.asp

Jul 06, 2017 -

SHENMAO Exhibits at SEMICON WEST July 11-13, 2017 Booth # 5716 Introduces New Low Residue Liquid Flux SMF-B51

Jun 25, 2017 -

SHENMAO Exhibits at IMAPS System in Package June 27-28, 2017 Introducing 3 New Semiconductor Packaging Fluxes

May 03, 2017 -

SHENMAO America, Inc. Exhibits Monday, May 8 Booth # 7

Mar 20, 2017 -

SHENMAO America, Inc. Introduces Omega Aleaciones S.A. de C.V. the Exclusive Mexico Distributor of SHENMAO Solder Paste & Flux

Feb 01, 2017 -

SHENMAO America, Inc. Sponsors the SMTA Pan Pacific Microelectronics Symposium, February 6-9, 2017

Jan 30, 2017 -

SHENMAO America, Inc. Exhibits February 14 - 16 at IPC APEX EXPO 2017 Booth # 1532 San Diego Convention Center

Oct 09, 2016 -

SHENMAO Technology presents a Poster at the 13 th. IWLPC At DoubleTree Airport Hotel by Hilton, San Jose, CA, USA

Oct 09, 2016 -

SHENMAO America, Inc. Exhibits October 18-19 at IWLPC Introduces Semiconductor Packaging Materials

Sep 26, 2016 -

SHENMAO Introduces Room Temperature Storable RT Series Solder Paste at SMTAI Booth # 800 September 27-28, 2016

Sep 13, 2016 -

SHENMAO Exhibits at SMTA International at Donald E Stephens Convention Center, Rosemont, Il September 27-28, 2016 Booth # 800

21 more news from Shenmao Technology Inc. »

Jul 21, 2017 -

Help customer solve problems of 750L machine

Jul 19, 2017 -

Digicom Electronics Receives AS9100:2016 (RevD) Aerospace and ISO 9001:2015 Certifications

Jul 19, 2017 -

Conecsus Presents SMT Metals Waste Recycling Solutions at SMTAI 2017

Jul 19, 2017 -

New Metcal HTD Tips & Hand-piece Increase Throughput and Save Money

Jul 19, 2017 -

Altus Supports Bespoke Desktop Robots for Automated Soldering, from ATN Germany

Jul 19, 2017 -

STI Acquires Fischerscope X-ray XDAL 237

Jul 19, 2017 -

COT Reduces Prices on SMT Nozzles & Consumables

Jul 19, 2017 -

Cogiscan Partners with iBASEt for Automated Electronics Assembly

Jul 19, 2017 -

International Wafer-Level Packaging Conference (IWLPC) Program Announced and Registration Now Open

Jul 19, 2017 -

Logic PD Appoints Eric Wilkowske as Vice President of Products, Design & Engineering

See electronics manufacturing industry news »

SHENMAO Exhibits at SEMICON WEST July 11-13, 2017 Booth # 5716 Introduces New Tacky Flux SMF-WC52 for Flip Chip Technology news release has been viewed 111 times

  • SMTnet
  • »
  • Industry News
  • »
  • SHENMAO Exhibits at SEMICON WEST July 11-13, 2017 Booth # 5716 Introduces New Tacky Flux SMF-WC52 for Flip Chip Technology
BGA Rework Services

Used SMT Equipment