SMT, PCB Electronics Industry News

Versatile Dispensing Solutions from Techcon at NEPCON China

Mar 21, 2017

TS8100 Series Positive Displacement PC Pump.

TS8100 Series Positive Displacement PC Pump.

Techcon Systems, a product group of OK International and a leading provider of fluid dispensing systems and products, will exhibit in Stand 1H39 at NEPCON China, scheduled to take place April 25-27, 2017 at the Shanghai World EXPO Exhibition & Convention Center. The Techcon team will demonstrate the TS8100 Series Positive Displacement PC Pump, TS9000 Jet Valve, TS9300HM Hot Melt Valve, and TSR2201 Dispensing Robot.

The continuously volumetric dispense pump is based on Progressive Cavity (PC) technology. Due to the PC pump’s unique dispensing technology, accuracy and repeatability of ± 1 percent is achievable. The TS8100 comes standard with a syringe bracket, mounting bracket kit, luer lock fitting, cleaning kit and dispensing tip selection pack. Typical applications include: under filling PCBA components, encapsulation and potting applications, applying lubrication on automotive parts, and dispensing pastes and flux.

The TS9000 Series Jet Tech Valve is a piezoelectric driven, non-contact dispense valve capable of handling fluid viscosities to 2 million Cps and offers a fast jetting action producing hundreds of accurate deposits less than one second. The Jet Tech features a compact size and modular design that can be integrated into robotic systems, and adjustable parameter settings allowing the operator to change the jetting properties for different fluid types and optimize the process for repeatable dispensing.

The TS9300HM Series PUR Hot Melt Jet Valve features patented diaphragm technology and is easy-to-use and clean. A single replaceable diaphragm eliminates dynamic fluid seals common in all other jets. Only the nozzle plate and diaphragm are in contact with the fluid. The jetting mechanism is isolated from the fluid to ensure contamination-free operation.

The TSR2000 Bench Top Robot Series has been designed for a wide range of fluid dispensing applications, from inline to batch. The versatile TSR2000 dispensing platforms deliver consistent, high-performance dispensing results at an affordable price. The TSR2000 Series is ideal for the following applications: dispense dots of solder paste, form-in-place gasket, filling, potting, encapsulation, bonding, coating and many more. Three models are available (TSR2201, TSR2301 and TSR2401) to accommodate a wide range of working envelopes.

Company representatives also will showcase consumable plastic containers, including cartridges, syringes, Techkits, squeeze bottles and clever barrier bags. For more information, please contact the Techcon Systems team at (714) 230-2398 or visit www.techcon.com.


Techcon Systems was established in 1961 to service industrial manufacturing markets and has continued to be a leader in fluid dispensing systems and products. In 1996, OK International acquired Techcon Systems, providing a strong global sales channel, with direct subsidiaries in the UK. Today, Techcon represents OK International’s Industrial Product Division. Currently focusing on fluid dispensing systems, Techcon’s components are used in medical, automotive, telecommunications, aerospace, and industrial applications worldwide, helping to improve manufacturing processes and increase the customers’ bottom lines. Techcon offers an array of fluid dispensing products and provides dispensing components ranging from disposable accessories to complete microprocessor-controlled dispensing systems, and precision valves. For more information, visit the company at www.techcon.com.

Jun 21, 2018 -

New Applicator Guns from Techcon at Farnborough International Airshow

May 21, 2018 -

New Lightweight Cartridge Applicators from Techcon

May 08, 2018 -

Techcon to Show New Smart Dispensing Robot, Valve Controllers and Pneumatic Applicators at SMT Hybrid Packaging

Apr 25, 2018 -

Techcon Releases TSR2000 Series Smart Dispensing Robots

Apr 24, 2018 -

Techcon Systems Announces New Territory Sales Manager

Mar 26, 2018 -

Techcon to Show New Smart Dispensing Robot & Valve Controllers at NEPCON China

Mar 19, 2018 -

Techcon Introduces New Valve Controllers for the Smart Factory

Jan 28, 2018 -

Techcon to Demo a Range of Advanced Technologies at MD&M West 2018

Nov 10, 2017 -

Techcon Announces New Products at productronica Following New Brand Launch

Oct 24, 2017 -

Techcon Announces New Branding, Features and Products

97 more news from Techcon Systems »

Jun 21, 2018 -

New Applicator Guns from Techcon at Farnborough International Airshow

Jun 21, 2018 -

IPC’s PCB Technology Trends Study Underway, PCB Fabricator Survey Open Until July 13

Jun 21, 2018 -

YXLON International to Host Three Open House Events at Its Lab One Facility

Jun 21, 2018 -

ROSIN RESINS FOR SOLDERING SOLUTION

Jun 20, 2018 -

ECO-FRIENDLY MEETS HIGH-TECH – Product Launch at Nepcon Thailand

Jun 20, 2018 -

KYZEN Sees Growth in Asia & Expands Marketing Support

Jun 20, 2018 -

IPC Extends Deadline on Call for Participation for IPC APEX EXPO 2019 Deadline for technical conference paper abstracts extended to: June 29, 2018

Jun 20, 2018 -

Inspection Services Labs in San Jose and Ohio Now Fully Equipped with Non-Destructive Testing Technology

Jun 20, 2018 -

VJ Electronix Promotes Frank Cosentino to Western Regional Sales Manager for the Americas

Jun 20, 2018 -

Scienscope Expands Partnership with Restronics

See electronics manufacturing industry news »

Versatile Dispensing Solutions from Techcon at NEPCON China news release has been viewed 15 times

fluid dispensing pumps for integration

boost underfilling speed