Feb 05, 2017 
Solder balls and solder beading have been a process issue for many years and they may not cause product failure or quality problems but they are not desirable. Solder balls are caused by a variety of factors in different processes and should be resolved to eliminate a poorly defined process or a process and materials which are out of control
With over 40 years in industry and 30 solving process problems for industry Bob Willis explains the causes and curses for solder balls. Bob’s webinar features many unique process video clips on testing and failures and make his sessions come alive providing a much better understanding of the root cause of failure and corrective action
For further details go to http://www.bobwillis.co.uk/event/solder-ball-elimination-in-wave-selective-reflow/
Presented by Bob Willis
Each webinar last approximately 60-90 mins with the opportunity for questions. Delegates can send their own solder balling problems for discussion during the webinar
Topics covered include:
What are solder beads & balls?
What causes these defects?
Why does PCB design & specification matter?
Solder process & materials
Tin/lead v Lead-Free
Solder ball & bead formation
Causes/cures for random & designer balls
Inspection criteria
A copy of the slides presented during the webinar are provided at the end of the event
