SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from Akrometrix


Akrometrix Announces Next-Generation AXP Shadow Moiré System

Oct 04, 2016

Next-generation Shadow Moiré System – the AXP 2.0.

Next-generation Shadow Moiré System – the AXP 2.0.

Akrometrix, LLC, the leading provider of thermal warpage and strain metrology equipment to both the front- and back-end semiconductor and electronics industries, today announced its next-generation Shadow Moiré System – the AXP 2.0.

Akrometrix has been supplying thermal warpage systems for more than 20 years utilizing the shadow moiré technique and has now developed its next-generation AXP which provides unparalleled warpage metrology with state-of-the-art lateral/top-bottom temperature uniformity. This new AXP 2.0 is the industry leader in not only providing thermal warpage, but has optional modules for both DIC strain/CTE measurements and DFP for discontinuous surfaces. Utilizing a novel combination of both top and bottom heaters with shadow moiré, Akrometrix is providing temperature uniformity previously unattainable in the industry on a flexible/configurable platform.

Mayson Brooks, Akrometrix’s CEO states, “The significant engineering expertise at Akrometrix has enabled us to develop this next-generation system for warpage metrology that will meet our customers’ technology needs today and for the next several years. With the uniformity improvements, along with a wide range of other developments, the AXP 2.0 is well positioned to maintain Akrometrix’s market leader position of providing quick, timely and innovative solutions for our customers’ warpage metrology demands.”

For more information about Akrometrix’s warpage metrology systems, please contact sales@akrometrix.com or visit www.akrometrix.com.


Akrometrix is the leader in thermal warpage and strain metrology for the front-end/back-end wafer, back-end packaging/assembly, panel and the PCB/component markets. The company provides both capital equipment and test services to measure warpage and strain in temperatures from -50°C to 300°C on virtually any substrate up to 600mm x 600mm, regardless of shape. Located in Atlanta, Georgia, Akrometrix has been serving customers worldwide for more than 20 years based on technology developed at Georgia Tech. For more information, contact Akrometrix at sales@Akrometrix.com or visit www.akrometrix.com.

You must be a registered user to talk back to us.

More News from Akrometrix

Oct 04, 2016 -

Akrometrix Announces Next-Generation AXP Shadow Moiré System

Sep 23, 2016 -

Understanding PCB Design & Material Warpage Challenges – Learn More at SMTAI

Sep 22, 2016 -

Akrometrix Announces New Schedule for Technical Presentations

May 05, 2016 -

Akrometrix Announces the Release of the CRE6, Convection Reflow Emulation for Warpage Metrology

Apr 29, 2016 -

Akrometrix Announces the Shipment of Its 300th Shadow Moiré System

Mar 30, 2016 -

Akrometrix Announces Enhanced Digital Image Correlation (DIC) Module

Feb 25, 2016 -

Akrometrix Announces Automated Die Attach Tilt Metrology

Feb 23, 2016 -

Thermal Warpage and Strain Metrology Platforms will be Displayed at GOMACTech

Feb 18, 2016 -

PAC Global to Discuss Thermal Warpage and Strain Metrology Solutions from Akrometrix at Upcoming SMTA Expos

Feb 17, 2016 -

Akrometrix LLC Will Discuss Thermal Warpage and Strain Metrology at APEX

(9) more news from Akrometrix

Akrometrix Announces Next-Generation AXP Shadow Moiré System news release has been viewed 131 times

PCB Buffers

SMT Equipment Service