SMT, PCB Electronics Industry News

SEMICON WEST 2016 is 2 Weeks Away, Visit YINCAE Booth 6448

Jun 22, 2016

(Albany, NY) 22 June 2016 - The SEMICON West 2016, North America's premier Microelectronics event is less than two weeks away! SEMICON West 2016 will be held at the Moscone Center in San Francisco, CA from July 12th to 14th. We sincerely invite you to stop by our Booth 6448 to learn more about YINCAE Advanced Materials. 

YINCAE offers a variety of exclusive Adhesives, Thermal Interface, and Chip/Board/Packaging level materials that have been adopted by leading contract manufacturers and Tier 1 Microelectronic suppliers. Recipient of the 2015 Global Technology Award; YINCAE innovated the WORLD's FIRST Lead-Free Solder Joint Encapsulation Adhesive solutions for wafer level, flip chip, POP, LGA, BGA and many more applications. YINCAE offers SJEA for low, medium, and high temperature solder alloy applications for your individualized needs.

YINCAE Advanced Materials, LLC hopes that you are finalizing preparation for the SEMICON WEST 2016. We are looking forward to seeing you in the North Hall at booth 6448 and will be available to talk about our products and answer any questions that you may have. We hope that you will join us at the conference to learn about YINCAE and the products that we have to offer. We develop exclusive products that no other company can provide. We look forward to seeing you at booth 6448! 

If you wish to visit the official website of YINCAE Advanced Materials, LLC, please visit us at www.yincae.com.

* * * * * * * * * *

Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

 ###

The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

Jan 16, 2018 -

Press Release: YINCAE’S New Reflowable Underfill Material: SMT 160

Jan 16, 2018 -

Press Release: Low Temperature Reflowable Underfill Material: SMT 160L

Jan 08, 2018 -

IPC APEX 2018 is 1 month away! Visit YINCAE at Booth 2732

Dec 22, 2017 -

DA 150 High Temperature, Fast Cure Die Attach Adhesive Series Materials

Dec 04, 2017 -

IPC APEX 2018 is 2 months away! Visit YINCAE at Booth 2732

Oct 25, 2017 -

YINCAE’S New High Purity Liquid Encapsulant: SMT 158HA

Oct 02, 2017 -

IMAPS 2017 is Next Week VISIT YINCAE BOOTH # 416 Join Dr. Yin’s Presentation October 10th at 2:30 PM Room 305A

Sep 25, 2017 -

IMAPS 2017-Raleigh 2 weeks away, visit YINCAE Booth 416

Sep 12, 2017 -

SMTA International - Join Dr. Yin’s Presentation September 20th

Sep 11, 2017 -

YINCAE to Exhibit at iMAPS INTERNATIONAL 2017

33 more news from YINCAE Advanced Materials, LLC. »

Jan 18, 2018 -

Cobar Solder Products Inc. at IPC APEX EXPO 2018

Jan 17, 2018 -

Inovaxe to Showcase Its Intelligent Ultra-Lean Total Material Handling and Storage Solution at SMTA Space Coast Expo

Jan 17, 2018 -

Schleuniger Introduces CableCoiler 1450 Single Pan Coiling System

Jan 17, 2018 -

Schleuniger Introduces CableCoiler 1450 Single Pan Coiling System

Jan 17, 2018 -

Schleuniger Introduces CableCoiler 1450 Single Pan Coiling System

Jan 17, 2018 -

CalcuQuote Exhibits at IPC APEX Expo 2018

Jan 17, 2018 -

Data I/O Expands Market Leading LumenX Platform to Support Universal Flash Storage (UFS)

Jan 16, 2018 -

Female Leaders in Tech, Everywhere rising high as mentor Michelle Ogihara joins as Ambassador for the U.S.

Jan 16, 2018 -

Preview for IPC Apex 2018 San Diego, booth # 3007 JTAG Visualizer Update Adds Features for Faster Debug Assess PCB assembly fault coverage and find board build errors quicker

Jan 16, 2018 -

Seika’s Michelle Ogihara Joins FLITE as Ambassador for the U.S.

See electronics manufacturing industry news »

SEMICON WEST 2016 is 2 Weeks Away, Visit YINCAE Booth 6448 news release has been viewed 605 times

PCB Assembly Equipment Auctions

pcb components vacuum pick up