SMT, PCB Electronics Industry News

SEMICON WEST 2016 is 2 Weeks Away, Visit YINCAE Booth 6448

Jun 22, 2016

(Albany, NY) 22 June 2016 - The SEMICON West 2016, North America's premier Microelectronics event is less than two weeks away! SEMICON West 2016 will be held at the Moscone Center in San Francisco, CA from July 12th to 14th. We sincerely invite you to stop by our Booth 6448 to learn more about YINCAE Advanced Materials. 

YINCAE offers a variety of exclusive Adhesives, Thermal Interface, and Chip/Board/Packaging level materials that have been adopted by leading contract manufacturers and Tier 1 Microelectronic suppliers. Recipient of the 2015 Global Technology Award; YINCAE innovated the WORLD's FIRST Lead-Free Solder Joint Encapsulation Adhesive solutions for wafer level, flip chip, POP, LGA, BGA and many more applications. YINCAE offers SJEA for low, medium, and high temperature solder alloy applications for your individualized needs.

YINCAE Advanced Materials, LLC hopes that you are finalizing preparation for the SEMICON WEST 2016. We are looking forward to seeing you in the North Hall at booth 6448 and will be available to talk about our products and answer any questions that you may have. We hope that you will join us at the conference to learn about YINCAE and the products that we have to offer. We develop exclusive products that no other company can provide. We look forward to seeing you at booth 6448! 

If you wish to visit the official website of YINCAE Advanced Materials, LLC, please visit us at www.yincae.com.

* * * * * * * * * *

Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

 ###

The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

Jun 20, 2017 -

SEMICON West is 1 Month Away, Visit Yincae at Booth 5248

Jun 19, 2017 -

DA 90 Low Temperature Die Attach Adhesive Series Materials

Jun 13, 2017 -

SMT 158UL Highly Filled Room Temperature Underfill

Jun 06, 2017 -

SMT 88UL Super-Fast Flow Room Temperature Underfill

Jun 05, 2017 -

New Innovative Solder Joint Encapsulant Paste: SMT 256EP

May 04, 2017 -

PRESS RELEASE: SEMICON West July 11-13, 2017

Jan 24, 2017 -

PRESS RELEASE: New Product Announcement

Jan 18, 2017 -

Press Conference at IPC APEX EXPO 2017

Jan 13, 2017 -

IPC APEX EXPO is 1 month away

Aug 24, 2016 -

SMTA INTERNATIONAL JUST A MONTH AWAY! VISIT YINCAE BOOTH #129 September 27th & 28th

17 more news from YINCAE Advanced Materials, LLC. »

Jun 27, 2017 -

Flying Probe, Functional Test & Inline Test – Visit Acculogic at SMTA Ohio Expo

Jun 27, 2017 -

VJ Technologies and Datest Partner in West Coast Inspection Services, Showroom and Demonstration Center.

Jun 26, 2017 -

Altus get SMART with Koh Young’s Innovative New Software

Jun 26, 2017 -

Ersa to Hold Versaflow 3 Level II Maintenance Training Course

Jun 25, 2017 -

Libra Industries’ Christopher R. Howell Memorial Foundation Awards $20,000 in Scholarships during Annual Golf Outing

Jun 25, 2017 -

SHENMAO Exhibits at IMAPS System in Package June 27-28, 2017 Introducing 3 New Semiconductor Packaging Fluxes

Jun 25, 2017 -

Ersa Brings the ‘Little Big One’ to SMTA Ohio – Award-Winning Selective Solder

Jun 25, 2017 -

Optimal Electronics Releases Process Control and Traceability Solution for Nordson ASYMTEK Applications in Clean Rooms for Sensor Assembly

Jun 25, 2017 -

Inovaxe Partners with Repstronics in Mexico

Jun 22, 2017 -

PNC Inc. Invests in LED Laser Direct Imaging system from Miva Technologies

See electronics manufacturing industry news »

SEMICON WEST 2016 is 2 Weeks Away, Visit YINCAE Booth 6448 news release has been viewed 372 times

Smart Factory Starter Kit - KIC

Reflow Oven