SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • International Wafer-Level Packaging Conference (IWLPC) Keynote Presenters Announced

International Wafer-Level Packaging Conference (IWLPC) Keynote Presenters Announced

Jun 19, 2016

The SMTA and Chip Scale Review magazine are pleased to announce the Keynote Presenters for the 13th Annual International Wafer-Level Packaging Conference. The IWLPC will be held October 18-20, 2016 at the DoubleTree Airport Hotel in San Jose, California.

Klaus-Dieter Lang, Ph.D., Fraunhofer IZM is scheduled to give the keynote presentation on the first day of the conference on “Advanced Technology Platforms for Next Generation of Smart Systems.” The trend to establish smart electronic systems in an increasing number of application fields (e.g., Internet of Things) is enormous. But because of huge product variation, the main precondition to manufacture such systems is complex design tools, standardized leading edge processes, and system oriented test procedures. The allocation of innovative technology platforms (e.g., advanced assembly and packaging) and extended test principles (e.g., technology and functionality) are needed to achieve high yields and reasonable costs. Presentation topics include application conditions, integration technologies and reliability aspects for smart electronic systems. Examples from wearables, communication and production illustrate the advantage of their use.

Prof. Lang studied Electrical Engineering and received his M.S. Equivalent Diploma (Metallization Layers on GaAs). In 1985, he received his Ph.D. and in 1989 he received his Doctor of Technical Science. In 1993, he became Section Manager for Chip Interconnections at Fraunhofer IZM and from 2003 he headed the Department "Photonic and Power System Assembly.” Since 2011, he has been the Director of the Fraunhofer IZM and responsible for the chair "Nano Interconnect Technologies" at the Technical University Berlin.

Rao R. Tummala, Georgia Institute of Technology, Ph.D., will deliver the keynote on the second day, entitled "Promise and Future of Embedding and Fan-Out Technologies.” All packaging technologies can be classified into two types. Wafer-level packaging (WLP) is one approach with ICs built directly into packages in the wafer fab by simply redistributing the BEOL I/Os and placing bumps. This is the best package electrically, but it is limited to small ICs and to small packages—typically below 5mm. As such, it is limited in external I/Os to connect to the board, typically at 400 microns and above in pitch.

To eliminate the I/O limitation issue, fan-out technology was initially developed in the 1980s and more recently further developed into production by Infineon. But this technology is not a wafer-level packaging, as described above; it is not a continuum of transistors to bumps. It did, however, address the I/O limitation. It is primarily an embedded packaging technology called, eWLP, that allowed fan-out of I/Os, in contrast to WLP, but also enabled embedding to reduce package thickness. This presentation will describe the promise and future of embedding and fan-out technologies.

Prof. Rao Tummala is a Distinguished and Endowed Professor Chair at Georgia Tech. He is well known as an industrial technologist, technology pioneer, and educator. He is the father of LTCC and System-on-Package Technologies.Visit www.iwlpc.com for more information.

Jun 20, 2017 -

SMTA Launches New Partnership with Thayer School of Engineering at Dartmouth College

Jun 08, 2017 -

SMTA International Conference Program Finalized and Registration Now Open

May 30, 2017 -

SMTA and CALCE Seeking Abstracts for 3rd Annual LED Assembly, Reliability, and Test Symposium

May 23, 2017 -

SMTA, iNEMI, MEPTEC Seek Presenters for 2018 Medical Electronics Symposium

May 15, 2017 -

SMTA China Presents Seven Best Paper/Best Presentation Awards and Two Best Exhibit Awards at SMTA China East Conference 2017/NEPCON China 2017

Apr 26, 2017 -

SMTA/CALCE Announce Program for Symposium on Counterfeit Parts and Materials

Apr 11, 2017 -

IBM and Siemens Experts to Keynote Contamination, Cleaning and Coating Conference

Apr 07, 2017 -

The SMTA Capital Chapter to Host a Meeting April 25th at ZESTRON Americas

Mar 15, 2017 -

Contamination, Cleaning and Coating Conference Program Finalized

Feb 05, 2017 -

SMTA Announces 2017 Educational Programming

547 more news from Surface Mount Technology Association (SMTA) »

Jun 25, 2017 -

Optimal Electronics Releases Process Control and Traceability Solution for Nordson ASYMTEK Applications in Clean Rooms for Sensor Assembly

Jun 25, 2017 -

Inovaxe Partners with Repstronics in Mexico

Jun 22, 2017 -

PNC Inc. Invests in LED Laser Direct Imaging system from Miva Technologies

Jun 22, 2017 -

Addressing The Modulation of Light Output -- High Quality LED Manufacturing

Jun 22, 2017 -

Schleuniger, Inc. Receives 2017 Best of Manchester Award

Jun 21, 2017 -

Inovar Inc. Breaks Ground for New Facility on USU Innovation Campus

Jun 21, 2017 -

PNC Inc. Launches Design Webinar Series

Jun 21, 2017 -

Saelig Introduces Mercury™ T2C USB 2.0 & Power Delivery Protocol Analyzer With Type-C Connection

Jun 20, 2017 -

Europlacer Secures Fourth Award from Industry Analysts Frost & Sullivan.

Jun 20, 2017 -

In Memory of Jim D. Raby, PE

See electronics manufacturing industry news »

International Wafer-Level Packaging Conference (IWLPC) Keynote Presenters Announced news release has been viewed 442 times

  • SMTnet
  • »
  • Industry News
  • »
  • International Wafer-Level Packaging Conference (IWLPC) Keynote Presenters Announced
SMT Custom Nozzles

Reflow Ovens thermal process improvement